Fabrication of an hermetically packaged silicon resonator on LTCC substrate

Toàn, Nguyễn Văn; Miyashita, Hidetoshi; Toda, Masaya; Kawai, Yusuke; Ono, Takahito

doi:10.1007/s00542-012-1716-5

Cited by 33 publications

(23 citation statements)

References 25 publications

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“…The sandblast process can be used for etching various materials such as glass [13], ceramics [2] (example: LTCC (low temperature co-fired ceramics)), and silicon.…”

Section: Experiments and Discussionmentioning

confidence: 99%

“…Due to the superior material properties of glass, including transparency, mechanical robustness, and dielectric properties, the glass has been widely used for micro-nano mechanical systems [1,2], micro-nano fluidic devices [3,4], and optical MEMS (Microelectromechanical systems) devices [5]. The glass substrate can be easily joined to a silicon substrate via the anodic bonding process without any additional adhesive, whereas these bond seals show good hermetic vacuum [6,7] and high bonding strength [8].…”

Section: Introductionmentioning

confidence: 99%

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An Investigation of Processes for Glass Micromachining

2016

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This paper presents processes for glass micromachining, including sandblast, wet etching, reactive ion etching (RIE), and glass reflow techniques. The advantages as well as disadvantages of each method are presented and discussed in light of the experiments. Sandblast and wet etching techniques are simple processes but face difficulties in small and high-aspect-ratio structures. A sandblasted 2 cm × 2 cm Tempax glass wafer with an etching depth of approximately 150 µm is demonstrated. The Tempax glass structure with an etching depth and sides of approximately 20 μm was observed via the wet etching process. The most important aspect of this work was to develop RIE and glass reflow techniques. The current challenges of these methods are addressed here. Deep Tempax glass pillars having a smooth surface, vertical shapes, and a high aspect ratio of 10 with 1-μm-diameter glass pillars, a 2-μm pitch, and a 10-μm etched depth were achieved via the RIE technique. Through-silicon wafer interconnects, embedded inside the Tempax glass, are successfully demonstrated via the glass reflow technique. Glass reflow into large cavities (larger than 100 μm), a micro-trench (0.8-μm wide trench), and a micro-capillary (1-μm diameter) are investigated. An additional optimization of process flow was performed for glass penetration into micro-scale patterns.

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“…The sandblast process can be used for etching various materials such as glass [13], ceramics [2] (example: LTCC (low temperature co-fired ceramics)), and silicon.…”

Section: Experiments and Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

An Investigation of Processes for Glass Micromachining

2016

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“…The equivalent circuit model of the capacitive resonators is reported in many works [10,11,12], and consisted of the motional resistance R m , motional inductance L m , motional capacitance C m , and feed-through capacitance C f .

L_{m} = \frac{m_{e f f}}{η^{2}}

C_{m} = \frac{η^{2}}{k_{e f f}}

R_{m} = \frac{\sqrt{k_{e f f} m_{e f f}}}{Q η^{2}}

η = V_{DC} ε_{0} \frac{L t}{g}

where Q is the quality factor of the resonator, t is the thickness of the resonator, and η is an electromechanical transduction factor.…”

Section: Device Descriptionmentioning

confidence: 99%

“…Also, their fabrication process is not compatible with complementary metal-oxide-semiconductor (CMOS) fabrication. Capacitive silicon resonators, on the other hand, are expected to overcome the above problems, as has been presented in many works [7,8,9,10,11,12,13]. An ultra-high Q factor can be achieved by capacitive silicon resonators, as reported in References [7,8,9].…”

Section: Introductionmentioning

confidence: 98%

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Design and Fabrication of Capacitive Silicon Nanomechanical Resonators with Selective Vibration of a High-Order Mode

et al. 2017

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This paper reports the design and fabrication of capacitive silicon nanomechanical resonators with the selective vibration of a high-order mode. Fixed-fixed beam capacitive silicon resonators have been successfully produced by the use of electron beam lithography, photolithography, deep reactive ion etching, and anodic bonding methods. All resonators with different vibration modes are designed to have the same resonant frequency for performance comparison. Measurement results show that higher-order mode capacitive silicon resonators can achieve lower insertion loss compared to that of lower-order mode capacitive silicon resonators. The motional resistance of the fourth mode vibration resonator is improved by 83%, 90%, and 93% over the third, second, and first mode vibration resonators, respectively.

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Low Cost and High‐Aspect Ratio Micro/Nano Device Fabrication by Using Innovative Metal‐Assisted Chemical Etching Method

et al. 2019

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In this paper, the metal‐assisted chemical etching (MACE) method is presented along with the advantages of using this method. Large areas and a combination of large and narrow patterning areas are successfully produced by using metal meshes for MACE. Moreover, in order to exemplify this microfabrication technique, the authors demonstrate the fabrications of different microelectromechanical systems (MEMS) devices; from simple structure (micro‐cantilever) to a complex structure (capacitive silicon resonator). Micro‐cantilever beam with resonant frequency of 262 kHz and quality factor of 8100 is successfully fabricated using this technique. Narrow capacitive gap width together with silicon resonator structure is also microprocessed by MACE technique. For the capacitive resonator, nano gaps with 250 nm‐width and 7 μm‐height is successfully micro‐fabricated using MACE process on a silicon on insulator (SOI) wafer. The resonant peak of the fabricated device is found at 81.4 MHz with quality factor of 4000 and motional resistance of 89 kΩ. The MACE process is performed in the wet etching solution that enables the fabrication of anisotropic silicon structures. This paper demonstrates that MACE method could potentially replace dry etching technique currently used for the fabrication of various electronics and photonics devices and energy applications. Due to the ease of implementation and possibility of batch fabrication, MACE method is a promising technique for the manufacturing of a broad range of high‐quality Si‐based devices at low cost.

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Fabrication of an hermetically packaged silicon resonator on LTCC substrate

Cited by 33 publications

References 25 publications

An Investigation of Processes for Glass Micromachining

An Investigation of Processes for Glass Micromachining

Design and Fabrication of Capacitive Silicon Nanomechanical Resonators with Selective Vibration of a High-Order Mode

Low Cost and High‐Aspect Ratio Micro/Nano Device Fabrication by Using Innovative Metal‐Assisted Chemical Etching Method

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