Fabrication of Arrays of Gold Islands on Self-Assembled Monolayers Using Pulsed Laser Deposition through Nanosieves

Speets, Emiel A.; Ravoo, Bart Jan; Roesthuis, F.J.G.; Vroegindeweij, F.; Blank, Dave H.A.; Reinhoudt, David N.

doi:10.1021/nl049774u

Cited by 32 publications

(29 citation statements)

References 29 publications

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“…In this geometry, a Au substrate usually serves as a bottom electrode. The top electrode could be metal nanoclusters prepared by vacuum vapor deposition [1][2][3][4][5][6][7][8][9][10] or from a suspension of metal nanoparticles. [11][12][13][14] Previous studies have shown that vapor-deposited Au or Ag penetrates into the SAM and inserts into the thiol-Au bond at the Au/ SAM interface when it is vacuum-deposited on an alkanethiol SAM with a methyl end group.…”

Section: Introductionmentioning

confidence: 99%

Electrochemical Metal Deposition on Top of an Organic Monolayer

Uosaki

2006

J. Phys. Chem. B

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Electrochemical deposition of metals (platinum or gold) only on top of an organothiolate, 1,4-benzenedimethanethiol (BDMT) or hexanedithiol (HDT), self-assembled monolayer (SAM) on a Au(111) substrate was achieved by electrochemical reduction of PtCl 4 2-or AuCl 4 -ion, which was preadsorbed on one free thiol end group of the dithiol SAM formed on a Au surface, in a metal-ion-free sulfuric acid solution at potentials more negative than the reduction potential of the metal ion. Angle-resolved X-ray photoelectron spectroscopy (AR-XPS) measurement after the reduction of preadsorbed PtCl 4 2-ion on BDMT/Au(111) electrode showed the presence of Pt not underneath but on top of the BDMT SAM. After a negative potential scan of the Pt/BDMT/Au(111) electrode to -1.30 V in 0.1 M KOH solution, a typical cyclic voltammogram of a clean Au(111) electrode was obtained, showing that the BDMT SAM with a Pt layer was reductively desorbed. These results proved that a Pt-BDMT SAM-Au substrate sandwich structure without a short circuit between the two metals was successfully constructed by this technique. Furthermore, a decanethiol (DT) monolayer was constructed on a Au layer, which was formed by the reduction of preadsorbed AuCl 4 -ion on HDT/Au(111) electrode. The formation of DT/Au/HDT/Au(111) structure was confirmed as two cathodic peaks corresponding to reductive desorption of DT from Au on top of the HDT/Au(111) at -0.97 V and that of Au/ HDT from Au(111) at -1.12 V were observed when potential was scanned negatively to -1.35 V.

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Section: Introductionmentioning

confidence: 99%

Electrochemical Metal Deposition on Top of an Organic Monolayer

Uosaki

2006

J. Phys. Chem. B

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“…AFM analyses show islands which are perfectly separated and well defined over a large area, with a very smooth morphology. Electrochemical copper deposition experiments from an aqueous CuSO 4 /H 2 SO 4 solution, using the sample with gold islands as working electrode, showed that the use of microstencils during PLD is a suitable technique for the creation of electrically isolated gold islands on SAMs [9]. The gap between the stencil and the substrate, the fluence of the laser and the gas pressure during deposition are critical parameters of deposition using shadow masks.…”

Section: Discussionmentioning

confidence: 99%

Exploring microstencils for sub-micron patterning using pulsed laser deposition

et al. 2004

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The possibilities of sub-micron patterning by means of microstencils using pulsed laser deposition were investigated. Stencils with circular and elliptical patterns were used, with pore sizes ranging from 1 µm down to 500 nm. Strontium titanate (SrTiO 3 ), silicon (Si) and self-assembled monolayers on gold were used as substrate materials, whereas nickel (Ni), nickel oxide (NiO) and gold (Au) have been deposited. The results show that the chosen deposition setup makes an easy and fast way for high-quality pattern creation.

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“…An additional advantage of stencil lithography over other patterning methods is its possible noncontact application avoiding cross-contamination or surface damage in case of fragile surfaces, whereas NIL needs hard contact and CP needs soft contact between master and substrate to transfer the pattern successfully. These specifics make stencil lithography applicable to full-wafer nonplanar surfaces such as MEMS devices and complementary metal-oxide-semiconductor chips [16] that can also be either mechanically unstable, such as cantilevers and membranes, and/or functionalized surfaces, such as, e.g., self-assembled monolayers [12]. Stencil lithography makes use of reusable, miniaturized shadow masks using thin solid-state membranes (e.g., SiN thinner than 500 nm for submicrometer apertures) to accommodate nanoaperture fabrication.…”

Section: Introductionmentioning

confidence: 99%

Silicon-Supported Membranes for Improved Large-Area and High-Density Micro/Nanostencil Lithography

Boogaart

Doeswijk

Brugger

2006

J. Microelectromech. Syst.

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Abstract-In this paper, the fabrication and use of stencils for full-wafer scale shadow mask (stencil) lithography is described. The stencils fabricated via microelectromechanical systems are mechanically stabilized and show clearly reduced stress-induced membrane deformation, which translates into a more accurate surface pattern definition. Solid-state SiN membranes 500 nm thick and up to 1 mm 2 in size having a 20-m-thick silicon support rim following the outline of the stencil apertures were fabricated in a 100-mm Si wafer. The minimum aperture size presented in this paper is 3 m. The increase of membrane stability was confirmed by depositing a highly stressed 35-nm-thick chrome layer. The results demonstrate a stability increase of the Si-supported compared to nonsupported membrane with identical shape by up to 89% as measured by the reduced out-of-plane deflection of overhanging membrane sections. Comparison by scanning electron microscopy and atomic force microscopy of the resulting micropatterns obtained by Cr deposition through both unsupported and Si-rim supported stencils shows better edge sharpness and clearer spatial details for surface patterns deposited through the stabilized stencil compared to those deposited through the nonsupported stencil. The improved stabilized stencils allow for large-area high-density surface patterning while maintaining membrane stability and pattern definition during stencil lithography.[

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Fabrication of Arrays of Gold Islands on Self-Assembled Monolayers Using Pulsed Laser Deposition through Nanosieves

Cited by 32 publications

References 29 publications

Electrochemical Metal Deposition on Top of an Organic Monolayer

Electrochemical Metal Deposition on Top of an Organic Monolayer

Exploring microstencils for sub-micron patterning using pulsed laser deposition

Silicon-Supported Membranes for Improved Large-Area and High-Density Micro/Nanostencil Lithography

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