Fabrication of Au Microstructure Using ICP-RIE

Abstract

UV lithography has been used in most case of microstructure patterning. However, it is difficult to form a fine rectangular microstructure in the thin film at a small width. On the other hand, silicon dry etching technology makes it possible to fabricate rectangular structures by repeating two steps of etching process and protection process. Then, we introduce the ability of Si dry etching technology in order to fabricate un-tapered, high precision Au microstructures containing rectangular patterns in order to fabricate Au microstructures. Au electroforming was realized from the bottom of the Si microstructure groove. We succeeded in forming about 4 m thick, void-free Au film in a space as narrow as 2.6 m in large effective area of 60 mm squares on 4 inch Si wafer. Therefore, it is expected to be used in the production of a wide variety of devices that have not yet been put into practice.

Fabrication of X-ray absorption grating by thermal composite method

“…In lithography, electroplating, and molding (LIGA) [27][28][29] technology is currently one of the main methods for manufacturing absorption gratings, but it relies on synchrotron radiation source. Micro-electro-mechanical systems (MEMS) [30][31][32] technology produces microstructures by grooves on silicon substrates, and then produces absorption gratings by means of electroplating gold. Electroplating usually takes several hours to form a thickness of tens of microns.…”

Fabrication of X-ray absorption grating using an ultracentrifuge machine

“…Although it is difficult to fabricate high-aspect-ratio hard-X-ray optics, several approaches have so far been reported for X-ray absorption grating. [37][38][39][40][41][42][43][44][45][46][47][48][49][50][51][52][53][54][55][56] Electroplating techniques combined with X-ray lithography [38][39][40][41]43,45,50,54) and deep etching 37,42,57) have so far been widely used. They have provided high-quality and large-area X-ray absorption gratings, and the technique combined with deep dry etching 42,57) should be promising in terms of cost-effectiveness, but electroplating normally requires more than a few hours for a few tens of μm thickness.…”

“…[37][38][39][40][41][42][43][44][45][46][47][48][49][50][51][52][53][54][55][56] Electroplating techniques combined with X-ray lithography [38][39][40][41]43,45,50,54) and deep etching 37,42,57) have so far been widely used. They have provided high-quality and large-area X-ray absorption gratings, and the technique combined with deep dry etching 42,57) should be promising in terms of cost-effectiveness, but electroplating normally requires more than a few hours for a few tens of μm thickness. Recently, high-throughput techniques such as microcasting 46,47,51,55,56) and metallic glass imprinting 48,52,53) were proposed.…”