2007
DOI: 10.1016/j.nima.2007.05.265
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Fabrication of back-illuminated, fully depleted charge-coupled devices

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Cited by 23 publications
(17 citation statements)
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“…Once the wafers are completed at LBNL, the DESI CCDs are tested in a probe station at −65 • C to screen out defective devices [9]. To date we have completed the processing of about 70 wafers, and the yield after the screening at −65 • C is about 40-45%.…”
Section: Ccd Fabrication and Packagingmentioning
confidence: 99%
“…Once the wafers are completed at LBNL, the DESI CCDs are tested in a probe station at −65 • C to screen out defective devices [9]. To date we have completed the processing of about 70 wafers, and the yield after the screening at −65 • C is about 40-45%.…”
Section: Ccd Fabrication and Packagingmentioning
confidence: 99%
“…Very rarely was even a single individual hot pixel identified in a dark image at 133 K. More common were manufacturing defects, the occasional hot column caused by a minor clock short or back-side defect. For a more detailed account of clock shorts and back-side defects, see [15].…”
Section: Irradiation At the Lbnl 88-inch Cyclotronmentioning
confidence: 99%
“…The CCD fabrication technology in use at LBNL has been described earlier [10], [11]. The majority of the fabrication steps are performed at a commercial foundry (DALSA Semiconductor), with the steps needed to produce back-illuminated devices done at LBNL.…”
Section: Ccd Development At Lawrence Berkeley National Laboratorymentioning
confidence: 99%
“…Since the large defects from the ISDP gettering process affect both the yield and the long-term reliability of the CCDs, it is important to minimize their occurrence and develop screening tests for their presence [11]. Particles of the type shown in Fig.…”
Section: Fabricationmentioning
confidence: 99%
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