Fabrication of electroluminescent carbon fiber composite for damage visualization

Qiu, Jun; Idris, Mohamad Kannan; Grau, Gerd; Melenka, Garrett W.

doi:10.1016/j.mfglet.2020.03.010

Cited by 6 publications

(1 citation statement)

References 4 publications

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“…These studies embed single fibers or yarns in structures, thus, the sensing is limited to the direction along the fibers. Another report has used CF fabric as capacitive electroluminescent sensors for wider area sensing on structure surfaces [22]. For composites that are naturally conductive such as CF composites, electrical resistivity tomography (ERT) detects the location of damage in composite sheets by measuring resistance between different points on the sheet.…”

Section: Introductionmentioning

confidence: 99%

Damage location sensing in carbon fiber composites using extrusion printed electronics

Idris¹,

Naderi²,

Melenka³

et al. 2021

Funct. Compos. Struct.

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Structural Health Monitoring (SHM) uses sensors in advanced engineering structures to evaluate integrity and detect damage or deformation affecting structural performance, e.g. cracks, holes, or corrosion. Carbon fiber (CF) textile composites are commonly used to reinforce structures such as aircraft, vehicles, or bridges due to their high tensile strength to weight ratio, chemical resistance, and thermal and electrical conductivity. Printing electronics on textiles is a scalable manufacturing technology combining the physical properties of textile materials with the added functionality of electronic elements making them self-sensing. Extrusion printing is a contactless digital printing method to print electrical conductors and passive circuit elements. This paper proposes to combine conventional CF composite manufacturing processes with printed conductors to create self-sensing CF textile composites. Damage is sensed by measuring resistance changes in a CF sheet. Contacts are extrusion printed directly on woven CF sheets using silver flake ink. A multiplexed Kelvin Double Bridge circuit is the read-out interface. This allows small resistance changes due to damage to be measured in a four-point configuration. The circuit is connected to the printed contacts on the CF sheet through multiplexers to detect damage in different locations. This 2D digital sensor can detect the location and size of damage holes for SHM. The resolution of the sensor is controlled by the location and spacing of the silver electrodes, which were studied experimentally and by simulation. The resolution is 26 mm in the current direction and 16 mm in the orthogonal direction. The threshold of detectable damage is 4 mm2. Simulation of the sensor as an isotropic 2D conductor shows good agreement with experimental results for the orthotropic fabric. The resultant sensing device could be integrated into many composite structures as one of its layers or simply printed on the surface to create smart structures.

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Section: Introductionmentioning

confidence: 99%

Damage location sensing in carbon fiber composites using extrusion printed electronics

Idris¹,

Naderi²,

Melenka³

et al. 2021

Funct. Compos. Struct.

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Dispense Printing of Silver Flake Inks on Hydrophilic and Hydrophobic Surfaces

Idris,

Grau

2024

Adv Eng Mater

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In printed electronics, achieving precise deposition of conductive materials on challenging substrates like Teflon is critical. This study delves into dispense printing, a technique that offers precision and versatility for creating electronic patterns. The deposition of high‐viscosity silver flake inks on both hydrophobic surfaces is investigated, such as Teflon, and hydrophilic ones, highlighting the significant interplay between ink viscosity and substrate wettability. This interaction is key to controlling ink spreading, drying behavior, and, ultimately, printing success. Research explores the relationships between critical parameters such as nozzle height, dispense pressure, and print speed, aiming to enhance the quality and functionality of printed electronics. The printing process is analyzed through its distinct phases: extrusion from the nozzle, spreading on the substrate, and line shrinking during drying. This methodological approach allows one to pinpoint how each parameter specifically influences the printing outcome, particularly on challenging substrates like Teflon. By advancing the understanding of these dynamics, the study offers valuable theoretical insights and practical advancements for fabricating high‐quality, flexible electronics across diverse substrates. The findings underscore dispense printing's potential to meet the growing demand for flexible electronics.

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