Cost-effective
copper conductive inks are considered as the most
promising alternative to expensive silver conductive inks for use
in printed electronics. However, the low stability and high sintering
temperature of copper inks hinder their practical application. Herein,
we develop rapidly customizable and stable copper–nickel complex
inks that can be transformed in situ into uniform copper@nickel core–shell
nanostructures by a self-organized process during low-temperature
annealing and immediately sintered under photon irradiation to form
copper–nickel alloy patterns on flexible substrates. The complex
inks are synthesized within 15 min via a simple mixing process and
are particle-free, air-stable, and compatible with large-area screen
printing. The manufactured patterns exhibit a high conductivity of
19–67 μΩ·cm, with the value depending on the
nickel content, and can maintain high oxidation resistance at 180
°C even when the nickel content is as low as 6 wt %. In addition,
the printed copper–nickel alloy patterns exhibit high flexibility
as a consequence of the local softening and mechanical anchoring effect
between the metal pattern and the flexible substrate, showing strong
potential in the additive manufacturing of highly reliable flexible
electronics, such as flexible radio-frequency identification (RFID)
tags and various wearable sensors.