Changes in protein-protein interactions may allow polypeptides to perform unexpected regulatory functions. Mammalian ShcA docking proteins have amino-terminal phosphotyrosine (pTyr) binding (PTB) and carboxyl-terminal Src homology 2 (SH2) domains, which recognize specific pTyr sites on activated receptors, and a central region with two phosphorylated tyrosine-X-asparagine (pYXN) motifs (where X represents any amino acid) that each bind the growth factor receptor-bound protein 2 (Grb2) adaptor. Phylogenetic analysis indicates that ShcA may signal through both pYXN-dependent and -independent pathways. We show that, in mice, cardiomyocyte-expressed ShcA directs mid-gestational heart development by a PTB-dependent mechanism that does not require the pYXN motifs. In contrast, the pYXN motifs are required with PTB and SH2 domains in the same ShcA molecule for the formation of muscle spindles, skeletal muscle sensory organs that regulate motor behavior. Thus, combinatorial differences in ShcA docking interactions may yield multiple signaling mechanisms to support diversity in tissue morphogenesis.
Printable and flexible Cu-Ag alloy electrodes with high conductivity and ultrahigh oxidation resistance have been successfully fabricated by using a newly developed Cu-Ag hybrid ink and a simple fabrication process consisting of low-temperature precuring followed by rapid photonic sintering (LTRS). A special Ag nanoparticle shell on a Cu core structure is first created in situ by low-temperature precuring. An instantaneous photonic sintering can induce rapid mutual dissolution between the Cu core and the Ag nanoparticle shell so that core-shell structures consisting of a Cu-rich phase in the core and a Ag-rich phase in the shell (Cu-Ag alloy) can be obtained on flexible substrates. The resulting Cu-Ag alloy electrode has high conductivity (3.4 μΩ·cm) and ultrahigh oxidation resistance even up to 180 °C in an air atmosphere; this approach shows huge potential and is a tempting prospect for the fabrication of highly reliable and cost-effective printed electronic devices.
hydrophobic and hydrophilic regions on surface can effectively guide fluidic inks to flow onto the designated regions spontaneously and result in the self-assembly patterning of functional materials. [2] The benefits of this process include facile operation, low equipment requirements, and large-scale producibility; as such there is huge potential for the fabrication of electronic devices, i.e., large-area organic photodiodes, [3] disposable sensors, [4] and flexible organic thin-film transistors (OTFTs). [5] However, thus far, the practical applicability of self-assembly patterning has been severely limited because the achievable resolution is lower than those obtained by conventional lithography technologies. [6] Considerable efforts have been devoted to improving the resolution and performance of self-assembled functional patterns. To this end, the constructions of repellent or attractive templates appear to be the two mainstream methods. In the case of the repellent templates, sacrificial layers with a low γ s can be constructed on a substrate using photolithography [7] or pattern transfer, [8] confining the functional ink within the uncovered regions and leading to spontaneous patterning. In the case of attractiveThe directed self-assembly of electronic circuits using functional metallic inks has attracted intensive attention because of its high compatibility with extensive applications ranging from soft printed circuits to wearable devices. However, the typical resolution of conventional self-assembly technologies is not sufficient for practical applications in the rapidly evolving additively manufactured electronics (AMEs) market. Herein, an ultrahigh-resolution self-assembly strategy is reported based on a dual-surface-architectonics (DSA) process. Inspired by the Tokay gecko, the approach is to endow submicrometer-scale surface regions with strong adhesion force toward metallic inks via a series of photoirradiation and chemical polarization treatments. The prepared DSA surface enables the directed self-assembly of electronic circuits with unprecedented 600 nm resolution, suppresses the coffee-ring effect, and results in a reliable conductivity of 14.1 ± 0.6 µΩ cm. Furthermore, the DSA process enables the layer-by-layer fabrication of fully printed organic thin-film transistors with a short channel length of 1 µm, which results in a large on-off ratio of 10 6 and a high field-effect mobility of 0.5 cm 2 V −1 s −1 .The ORCID identification number(s) for the author(s) of this article can be found under
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