Printable and Flexible Copper–Silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance

Li, Wanli; Hu, Dawei; Li, Lingying; Li, Caifu; Jiu, Jinting; Chen, Chuantong; Ishina, Toshiyuki; Sugahara, Tohru; Suganuma, Katsuaki

doi:10.1021/acsami.7b05308

Cited by 85 publications

(50 citation statements)

References 63 publications

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“…Typically materials are copper, silver, gold, or aluminium, see Table 1. Several attempts to produce such wires with an AM process have been reported [29][30][31]. But such processes usually create thin films of either silver [32] or copper [33] and cannot create the large 3D coils needed for motors.…”

Section: Introductionmentioning

confidence: 99%

Electrical resistivity of additively manufactured AlSi10Mg for use in electric motors

Silbernagel

Ashcroft

Dickens

et al. 2018

Additive Manufacturing

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Additive manufacturing (AM) opens up a design freedom beyond the limits of traditional manufacturing techniques. Electrical windings created through AM could lead to more powerful and compact electric motors, but only if the electrical properties of the AM printed part can be shown to be similar to conventionally manufactured systems. Until now, no study has reported on the suitability of AM parts for electrical applications as there are few appropriate materials available to AM for this purpose. AlSi10Mg is a relatively good electrical conductor that does not have the same reported issues associated with processing pure aluminium or copper via selective laser melting (SLM). Here, experiments were conducted to test the effects of geometry and heat treatments on the resistivity of AlSi10Mg processed by SLM. It was found that post heat treatments resulted in a resistivity that was 33% lower than the as-built material. The heat treatment also eliminated variance in the resistivity of as-built parts due to initial build orientation. By conducting these tests, it was found that, with this material, there is no penalty in terms of higher resistivity for using AM in electrical applications, thus allowing more design freedom in future electrical applications.

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Section: Introductionmentioning

confidence: 99%

Electrical resistivity of additively manufactured AlSi10Mg for use in electric motors

Silbernagel

Ashcroft

Dickens

et al. 2018

Additive Manufacturing

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“…The resistance of the sintered metal film was 50 Ω/sq for the CuAg film upon exposure to an air atmosphere at 220 °C, whereas it was significantly increased to 10 6 Ω/sq for the Cu-only ink. Li et al fabricated a mixed paste containing formic acid-treated submicron Cu particles and an Ag–amino complex for IPL sintering [ 146 ]. The photonic sintering could produce the core-shell structures consisting of a Cu-rich phase in the core and an Ag-rich phase in the shell (Cu-Ag alloy) on flexible substrates ( Figure 18 g).…”

Section: Formulation Designs In Cu-based Mixed Inks/pastesmentioning

confidence: 99%

“…Relative resistance is plotted as a function of oxidation time at 180 °C in the air. Reprinted with permission from reference [ 146 ], Copyright American Chemical Society, 2017.…”

Section: Figurementioning

confidence: 99%

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Tomotoshi

Kawasaki

2020

Nanomaterials

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Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effective and abundant, as compared to Ag. Moreover, the migration tendency of Cu is less than that of Ag. Thus, recently, Cu-based inks/pastes have gained increasing attention as conductive inks/pastes for printed/flexible electronics. However, the disadvantages of Cu-based inks/pastes are their instability against oxidation under an ambient condition and tendency to form insulating layers of Cu oxide, such as cuprous oxide (Cu2O) and cupric oxide (CuO). The formation of the Cu oxidation causes a low conductivity in sintered Cu films and interferes with the sintering of Cu particles. In this review, we summarize the surface and interface designs for Cu-based conductive inks/pastes, in which the strategies for the oxidation resistance of Cu and low-temperature sintering are applied to produce highly conductive Cu patterns/electrodes on flexible substrates. First, we classify the Cu-based inks/pastes and briefly describe the surface oxidation behaviors of Cu. Next, we describe various surface control approaches for Cu-based inks/pastes to achieve both the oxidation resistance and low-temperature sintering to produce highly conductive Cu patterns/electrodes on flexible substrates. These surface control approaches include surface designs by polymers, small ligands, core-shell structures, and surface activation. Recently developed Cu-based mixed inks/pastes are also described, and the synergy effect in the mixed inks/pastes offers improved performances compared with the single use of each component. Finally, we offer our perspectives on Cu-based inks/pastes for future efforts.

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“…Bochicchio et al found that the melting temperature range of Cu@Ag nanoparticles with chiral structure is the same as that of highly symmetric pure clusters of the same size, indicating that the clusters have significant thermal stability [ 1 ]. In addition, some experiments have shown that the core-shell nanomaterials formed by Cu nanoparticles wrapped with Ag nanoparticles not only improve the oxidation resistance of Cu nanoparticles, but also maintain their excellent electrical properties including high electrical conductivity and high oxygen reduction reaction activity [ 27 , 28 , 29 , 30 , 31 , 32 , 33 , 34 ]. Because nanoalloy’s properties are significantly determined by their morphologies and atomic packing patterns in these particles, the knowledge about the structural phases at different temperatures during cooling becomes essential to use them in a variety of novel applications.…”

Section: Introductionmentioning

confidence: 99%

Temperature and Composition Dependent Structural Evolution: Thermodynamics of CunAg135−n (n = 0–135) Nanoalloys during Cooling

2021

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Molecular dynamics simulations are performed to investigate the changes of packing structures, and thermodynamic quantities including internal energy, entropy, and free energy are used to determine temperature regime and transition time of atomic packing structures. The simulation results show different packing structures as the component composition changes, and there are different packing patterns during cooling. For these Cu-Ag alloy clusters containing only a small number of atoms of Cu, they present FCC packing structures in different parts at high temperatures, and then there are transformations to icosahedral structures. With the increase in content of Cu atoms, there is a transition mechanism from molten state to icosahedron. When the content of Cu atoms is appropriate, core-shell structures can be formed at room temperature.

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Printable and Flexible Copper–Silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance

Cited by 85 publications

References 63 publications

Electrical resistivity of additively manufactured AlSi10Mg for use in electric motors

Electrical resistivity of additively manufactured AlSi10Mg for use in electric motors

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Temperature and Composition Dependent Structural Evolution: Thermodynamics of CunAg135−n (n = 0–135) Nanoalloys during Cooling

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