Fabrication of Gold Patterns via Multilayer Transfer Printing and Electroless Plating

Başarír, Fevzihan

doi:10.1021/am201605q

Cited by 23 publications

(16 citation statements)

References 37 publications

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“…4,15,16 Although, this method is used for the creation of a multitude of structures intended from electrical circuits to drug delivery purposes, there is no unified theory or method how to perform the printing process or why it works. 15,17 Until now every 50 publication focusing on this topic states different effects being responsible for the µCP of PEM leading to contradictory statements and results in literature. 14, 15,18,19 Hammond and Park stated in their first publication electrostatic forces being the dominating effect, while they claimed hydrophobic forces being 55 dominant in a subsequent publication.…”

Section: Introductionmentioning

confidence: 99%

Micro-contact printing of PEM thin films: effect of line tension and surface energies

et al. 2015

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5Polyelectrolyte multilayer (PEM) thin films are popular candidates for surface coating due to their versatility, tunability and simple production method. Often these films are used in a 2D structured manner for creating defined cell scaffolds or electronic applications. Although these films were successfully printed in the past, the conditions and energies necessary for a successful printing were only investigated as isolated parameters or as a function of the substrate but not the PEM surface energy and therefore the 10 dominating forces remained controversial. We hereby present a theory and method for microcontact printing of condensed polyelectrolyte multilayer thin films, based on surface energies and the line tension. The theory relies on the surface energy of the substrate, stamp and PEM as well as the PEM line tension ratios to create the desired pattern. The presented theory is able to predict the printability, quality and resolution limit of a chosen system and was evaluated with experiments. A reduction of the production 15 time from the beginning of PEM assembly to the final pattern from several hours down to 30 minutes was achieved while increasing reproducibility and resolution of the printed patterns at the same time. We would like to point out, that this approach can generally be used for any kind of adsorbed thin film on substrates.

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Section: Introductionmentioning

confidence: 99%

Micro-contact printing of PEM thin films: effect of line tension and surface energies

et al. 2015

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“…Solutions containing active agents are rst printed with microcontact [12][13][14] or inkjet printing [15][16][17][18][19][20] methods to produce patterns on plastic substrates. Copper metal are then deposited selectively on the printed patterns in a subsequent electroless plating bath.…”

Section: -11mentioning

confidence: 99%

Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns

et al. 2017

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In this study, a thermally triggered self-reducible copper ink is developed to print conductive patterns on flexible substrates. Inks containing only copper formate (CuF) and monoisopropanol amine (MIPA) generated large bubbles in the CuF decomposing process, and thus the surface morphologies of prepared thin films were largely disturbed. With the addition of octylamine (OA), the bubbling disturbance was relieved due to the lower surface tension and the film uniformity was greatly improved. A low resistivity of 2 Â 10 À7 U m (8.5% of bulk copper) can be reached by heating the ink at 140 C for 5 minutes under a nitrogen environment. XRD results showed the synthesized copper films were comprised of pure metallic copper crystalline. The copper films were composed of closely packed spherical grains of 50 to 500 nm in diameter. After the addition of 1 wt% polyvinylpyrrolidone (PVP) in the ink, the synthesized copper thin films showed great adhesion on glass substrates, and sustained the same conductivity after repeated tape tests.The ink can also be printed on flexible substrates, such as polyethylene terephthalate (PET) or polyimide (PI) thin films, to create highly-conductive tracks with a strong mechanical stability. Finally, various conductive patterns were printed on flexible substrates to show the great potential of this ink for various printed electronic applications. IntroductionThe recent advancements in printing technology have provided a new fabrication method for exible and light-weight electronic devices at low costs. To fabricate these so-called printed electronic devices, inks containing conductive materials are printed on plastic sheets to produce exible microelectronic circuits. As the most essential part in every circuit, electrically conductive interconnects from metal inks have been widely used in these printed devices. To reduce the manufacturing cost, copper has recently attracted wide attention for printed conductive features because of its low price, and high electric conductivity. The most commonly used copper inks are nanoparticle suspensions. 1-7 The printed patterns can yield a low resistivity down to 2.2 times of that for bulk copper 2 aer sintering at 200 C for an hour. However, most plastic substrates might melt or deform at this high temperature. Alternatively, electroless plating approach offers a low-temperature synthetic route for copper thin lm fabrication on plastic surfaces. 8-11Solutions containing active agents are rst printed with microcontact 12-14 or inkjet printing 15-20 methods to produce patterns on plastic substrates. Copper metal are then deposited selectively on the printed patterns in a subsequent electroless plating bath. 12,13,15,16,19 Although electroless plating methods can produce highly conductive copper thin lms on exible substrates at low temperatures, the method needs two processing steps and the plating uid might contaminate or modify the plastic surfaces other than the patterned area. Thus, copper inks that can directly print on selected area with l...

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“…Printing technology has been gradually forward to unconventional, such as microcontact printing (μCP) [13][14][15], and ink-jet print [16][17][18], these print method always combines with electorless deposition, by controlling the position of activation place can selective decide the metal crystals grow and deposition. Electroless deposition is a stable and has been used in many process, this method without high cost equipment, and deposition at low temperature [9][10][11][12] is commonly used as a way. The general process of electroless deposition involves preparation of surface, activation by catalyst metal particaleson desire place, and immersed in electroless bath to deposition metal on the substrate, then metallization on the non-conductive substrate.…”

Section: Introducsionmentioning

confidence: 99%

The inkjet printing of catalyst Pd ink for selective metallization apply to product antenna on PC/ABS substrate

Wang

Nian

Luo

et al. 2013

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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In this paper, a simple and effective method to fabricate conductive antenna metal pattern on plastic substrates PC/ABS (poly(carbonate/Acrylonitrile-Butadiene-Styrene)) is described. This methods involves inkjet printing of copolymer/noble metal nanopartical-based ink on a PC/ABS substrate to create the catalyst site, onto which is subsequently deposited by an electroless plating method, to obtain metal pattern. The main challenge in electroless plating on plastics is to establish a good adhesion between the substrate and metallic film. The PC/ABS substrate was etching by environmental friendly etching solution, after printing, the plastic were immersed in an electroless plating bath to deposition Ni-P pattern. The prepared nickel film thickness is 11µm, which is excellent adhesion of the deposited Ni-P coating to the substrate according to ASTM D3359-78. Finally, a WWAN antenna was formed then test the Radiation characteristics. INTRODUCSIONThe applicaiotn of plastic to function fabrication of electronic devices such as radio-frequency identification (RFID) tag, sensor, antenna, and high precision metal pattern [1][2][3][4] in recent year. However, most of plastic are lack of electric conductivity. Therefore, fabrication metal onto polymer surface is necessary and unavoidable before their application, the technology of deposition metal on a plastic substrate has been tremendous attention. There's many deposition process to formed metal on substrate, such as photolithography and chemical vapor deposition(CVD) [5][6][7][8].Although photolithography could create high resolution metal line, but employ environmentally unfriendly chemicals would formed in the process. Most of substrate can't stand the high temperature in CVD process; both of them are high cost, complexity, and time-consuming. Printing technology has been gradually forward to unconventional, such as microcontact printing (μCP) [13][14][15], and ink-jet print [16][17][18], these print method always combines with electorless deposition, by controlling the position of activation place can selective decide the metal crystals grow and deposition. Electroless deposition is a stable and has been used in many process, this method without high cost equipment, and deposition at low temperature[9-12] is commonly used as a way. The general process of electroless deposition involves preparation of surface, activation by catalyst metal particaleson desire place, and immersed in electroless bath to deposition metal on the substrate, then metallization on the non-conductive substrate. It can also addition metal thickness follow by electroless to fabricate a smooth surface.The main challenge in electroless plating on plastics is to establish a good adhesion between the substrate and metallic film. The general methods for PC/ABS surface etching involves the chromic acid (H 2 CrO 4 ) solution, becaucse the carcinogen chrominum ion (Cr 6+ ) could impose serious environmental threat, more and more environmental friendly etching system has increased and the search for a re...

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Fabrication of Gold Patterns via Multilayer Transfer Printing and Electroless Plating

Cited by 23 publications

References 37 publications

Micro-contact printing of PEM thin films: effect of line tension and surface energies

Micro-contact printing of PEM thin films: effect of line tension and surface energies

Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns

The inkjet printing of catalyst Pd ink for selective metallization apply to product antenna on PC/ABS substrate

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