Fabrication of high aspect ratio insulating nozzle using glass reflow process and its electrohydrodynamic printing characteristics

Lee, Kyoung Il; Lim, B.K.; Oh, S.; Kim, Seong Hyun; Lee, Churl Seung; Cho, Jin Woo; Hong, Yongtaek

doi:10.1109/memsys.2014.6765803

Cited by 7 publications

(7 citation statements)

References 5 publications

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“…Due to the superior material properties of glass, including transparency, mechanical robustness, and dielectric properties, the glass has been widely used for micro-nano mechanical systems [1,2], micro-nano fluidic devices [3,4], and optical MEMS (Microelectromechanical systems) devices [5]. The glass substrate can be easily joined to a silicon substrate via the anodic bonding process without any additional adhesive, whereas these bond seals show good hermetic vacuum [6,7] and high bonding strength [8].…”

Section: Introductionmentioning

confidence: 99%

An Investigation of Processes for Glass Micromachining

2016

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This paper presents processes for glass micromachining, including sandblast, wet etching, reactive ion etching (RIE), and glass reflow techniques. The advantages as well as disadvantages of each method are presented and discussed in light of the experiments. Sandblast and wet etching techniques are simple processes but face difficulties in small and high-aspect-ratio structures. A sandblasted 2 cm × 2 cm Tempax glass wafer with an etching depth of approximately 150 µm is demonstrated. The Tempax glass structure with an etching depth and sides of approximately 20 μm was observed via the wet etching process. The most important aspect of this work was to develop RIE and glass reflow techniques. The current challenges of these methods are addressed here. Deep Tempax glass pillars having a smooth surface, vertical shapes, and a high aspect ratio of 10 with 1-μm-diameter glass pillars, a 2-μm pitch, and a 10-μm etched depth were achieved via the RIE technique. Through-silicon wafer interconnects, embedded inside the Tempax glass, are successfully demonstrated via the glass reflow technique. Glass reflow into large cavities (larger than 100 μm), a micro-trench (0.8-μm wide trench), and a micro-capillary (1-μm diameter) are investigated. An additional optimization of process flow was performed for glass penetration into micro-scale patterns.

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Section: Introductionmentioning

confidence: 99%

An Investigation of Processes for Glass Micromachining

2016

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“…The glass reflow process is a potential fabrication method for a wide range of microsystem applications [8,9,10]. A glass in silicon reflow process for three-dimensional (3D) microsystems has been presented in its simplest form [8], followed by variations to introduce additional features.…”

Section: Introductionmentioning

confidence: 99%

“…The optical window with and without liquid penetration for an application of optical modulators is demonstrated in [9]. The enhancement of the electro-hydrodynamic printing with a high aspect ratio nozzle using glass reflow is presented in [10]. The glass reflow process uses well-known techniques such as deep reactive ion etching (RIE), anodic bonding, and annealing (high temperature treatment) to create a generic structure wafer consisting of both silicon and glass.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process

et al. 2016

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This paper presents a process for the fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using glass reflow and anodic bonding techniques. Silicon through-wafer interconnects have been investigated by the glass reflow process. Then, the patterned silicon-glass reflow wafer is anodically bonded to an SOI (silicon-on-insulator) wafer for the fabrication of CMUT devices. The CMUT 5 × 5 array has been successfully fabricated. The resonant frequency of the CMUT array with a one-cell radius of 100 µm and sensing gap of 3.2 µm (distance between top and bottom electrodes) is observed at 2.84 MHz. The Q factor is approximately 1300 at pressure of 0.01 Pa.

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“…Due to the superior material properties of glass, such as transparency, mechanical robustness and dielectric properties, it has been widely used for micro-nano mechanical systems [1,2], micro fluidic [3] and optical MEMS devices [4]. Glass substrate can be easily joined to a silicon substrate by the anodic bonding process without any additional adhesive, whereas these bond seals show good hermetic vacuum [5,6] and high bonding strength [7].…”

Section: Introductionmentioning

confidence: 99%

“…The glass reflow process is a potential fabrication method for a wide range of microsystem applications. Enhancement of the electro-hydrodynamic printing with a high aspect ratio nozzle using glass reflow is presented in [3]. An intraocular pressure monitoring device is developed using a glass reflow process [11].…”

Section: Introductionmentioning

confidence: 99%

Glass reflow process for microsystem applications

Toàn

Sangu

Ono

2016

J. Micromech. Microeng.

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This paper reports on a glass reflow process and its applications to microsystems. Glass compounded silicon structures are achieved using a silicon mold under a high temperature environment, a long process time and assistance of enhancement of the surface wettability. Three applications employing the glass reflow process have been proposed and investigated. Firstly, the silicon through-wafer interconnects, embedded inside the Tempax glass, have been successfully demonstrated and show a resistance of about 10 Ω per feed-through. Secondly, a thick glass layer for thermal isolations is reported. The compounded glass can thermally isolate the heated silicon with a temperature difference of more than 100 °C when the temperature of the silicon part is 140 °C at an input power of 200 mW. Additionally, the silicon micro-heater is also evaluated for its reliability. Lastly, glass capillaries and pillars with and without liquid penetration have been proposed for obtaining the high resolution light field information. The optical windows integrated with an image sensor for an optical modulator are clearly demonstrated and a light modulation effect dependent on liquid penetration is observed.

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Fabrication of high aspect ratio insulating nozzle using glass reflow process and its electrohydrodynamic printing characteristics

Cited by 7 publications

References 5 publications

An Investigation of Processes for Glass Micromachining

An Investigation of Processes for Glass Micromachining

Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process

Glass reflow process for microsystem applications

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