2004
DOI: 10.1116/1.1635848
|View full text |Cite
|
Sign up to set email alerts
|

Fabrication of InP-based two-dimensional photonic crystal membrane

Abstract: Articles you may be interested inFabrication of high quality factor photonic crystal microcavities in In As P ∕ In P membranes combining reactive ion beam etching and reactive ion etchingSmooth sidewall in InP-based photonic crystal membrane etched by N 2 -based inductively coupled plasma Fabrication of two-dimensional InP-based photonic crystals by chlorine based chemically assisted ion beam etching J.The fabrication process of a InP-based two-dimensional photonic crystal membrane structure is developed. The … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2

Citation Types

0
16
0

Year Published

2005
2005
2018
2018

Publication Types

Select...
5
2
1

Relationship

1
7

Authors

Journals

citations
Cited by 24 publications
(16 citation statements)
references
References 20 publications
0
16
0
Order By: Relevance
“…Further fabrication details can be found in the references. 23 We next report results on pulse compression near the band-edge through the photonic crystal waveguide described above.…”
Section: Description Of Test Devicesmentioning
confidence: 97%
See 1 more Smart Citation
“…Further fabrication details can be found in the references. 23 We next report results on pulse compression near the band-edge through the photonic crystal waveguide described above.…”
Section: Description Of Test Devicesmentioning
confidence: 97%
“…The PC patterns were defined by electron-beam lithography and etched into the InP/InGaAsP by Reactive Ion Etching (RIE) using Methane-Hydrogen-Argon (MHA). 23 The InP substrate was subsequently removed by selective wet etching to create a thin membrane with air cladding for vertical optical confinement. A cross-section of a PC membrane is shown in Fig.…”
Section: Description Of Test Devicesmentioning
confidence: 99%
“…Indeed, it is now possible with plasma etching process using high density plasma reactors such as Inductive Coupled Plasma (ICP) to transfer nanometer scale patterns from the mask to the substrate [1][2][3][4][5]. The success of the high aspect ratio pattern transfer without geometrical defects [6][7][8][9] (bowing, undercut, trenching,..) is tributary of a good understanding of the physical and chemical mechanisms of the plasma discharge and the surface kinetic processes.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, it is very important to grow good quality and low TDD GaN-based epilayer. In the past decade, there have been a lot of studies focused on how to improve the crystalline quality of GaN-based epilayer, and attempted to grow ultra-flat surface, low TDD and high crystalline quality GaN-based epilayer on sapphire substrate, such as epitaxial lateral overgrowth (ELO) [5,6], cantilever epitaxy (CE) [7], microscale SiN x or SiO x patterned mask [8][9][10] and patterned sapphire substrate (PSS) [11][12][13][14][15][16][17].…”
Section: Introductionmentioning
confidence: 99%