Fabrication of metallic patterns by microstencil lithography on polymer surfaces suitable as microelectrodes in integrated microfluidic systems

Takano, Nao; Doeswijk, L M; Boogaart, M A F van den; Auerswald, Janko; Knapp, H.; Dubochet, Olivier; Hessler, T.; Brügger, J.

doi:10.1088/0960-1317/16/8/023

Cited by 27 publications

(23 citation statements)

References 29 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…These include microcontact printing (lCP) combined with metal etching, [10] electroless plating, [11] electropolymerization, [12] and direct metal layer transfer [13] for the microscale metal patterning on flexible substrates. Stencil lithography [14] was mainly applied for dielectric layer patterning on polymer substrates for the formation of electrical capacitors [15,16] due to its limited resolution. Inkjet printing was used for a drop-on-demand patterning of conductive polymer PEDOT [17] and gold [18] layers for drain-source and gate electrodes.…”

mentioning

confidence: 99%

Nanoscale Patterning and Electronics on Flexible Substrate by Direct Nanoimprinting of Metallic Nanoparticles

et al. 2008

View full text Add to dashboard Cite

Recent years have witnessed an expanding interest in the application of flexible polymer materials (e.g., polyimide, polyester, etc.) as the substrates for electronic and display devices. These applications include flexible organic light-emitting displays, [1,2] thin film transistors, [3][4][5] sensors, [6,7] and polymer MEMS. [8,9] The advantages of polymer-based materials are their mechanical flexibility, light weight, enhanced durability, and low cost compared with rigid materials (such as silicon and quartz). However, it can be difficult to integrate polymers into an integrated circuit (IC) microfabrication process due to their low thermal stability (low melting and low glass transition temperatures) and solvent susceptibility. In practice, conventional IC fabrication processes are subject to limitations, in that they are multi-step, involve high processing temperatures, caustic baths and strong solvents. In order to address the current problems of microfabrication on flexible substrate, many alternative approaches to conventional photolithography-based process have been introduced by a number of researchers. These include microcontact printing (lCP) combined with metal etching, [10] electroless plating, [11] electropolymerization, [12] and direct metal layer transfer [13] for the microscale metal patterning on flexible substrates. Stencil lithography [14] was mainly applied for dielectric layer patterning on polymer substrates for the formation of electrical capacitors [15,16] due to its limited resolution. Inkjet printing was used for a drop-on-demand patterning of conductive polymer PEDOT [17] and gold [18] layers for drain-source and gate electrodes. However, its best resolution is 20-50 lm [19,20] limited by the nozzle diameter, the statistical variation of the droplet flight, and spreading on the substrate. Organic semiconducting materials are being widely used as semiconducting layers in flexible electronics due to their costeffectiveness, mechanical flexibility, and ease of application via specific chemical modification. However, further channel size down-scaling is essential for better performance of organic field effect transistor due to the lower carrier mobility of the organic semiconducting materials. While the abovementioned methods cannot achieve ultrafine features (a few lm's down to ∼ 100 nm) in high aerial density and good reproducibility, nanoimprinting lithography (NIL) allows easy fabrication of precise nanoscale structures. NIL has been applied for nanopatterning in various fields such as biological nanostructures, [21] nanophotonic devices, [22,23] organic electronics, [24,25] and the patterning of magnetic materials. [26] Especially, metal nanopatterning via nanoimprinting is widely employed in nanoscale electronics and biosensing platforms. However, metal nanoimprinting has been typically an indirect process where a polymer (e.g., PMMA) pattern is first created by nanoimprinting, and then used as a mask for metal film etching or metal lift-off process. [27] This involves multiple and ...

show abstract

mentioning

confidence: 99%

Nanoscale Patterning and Electronics on Flexible Substrate by Direct Nanoimprinting of Metallic Nanoparticles

et al. 2008

View full text Add to dashboard Cite

show abstract

“…In the normal stencil process, we need to minimize the blurring to keep the width of a bridge pattern as small as possible, close to that of the original slit in the stencil. In the reverse process, although it still remains as a challenge to control the amount of blurring and obtain a high uniformity over a large substrate area [20,21], we can utilize the blurring for reducing the pattern width even further because a bridge structure of the stencil is first transferred as a narrower gap on the oxide layer. During the following steps transferring the gap to the reversed bridge pattern there was little change in the pattern size (figures 4(b), (c)).…”

Section: Formation Of Parallel Nanobridge Patterns By a Reverse Nanosmentioning

confidence: 99%

Patterning of parallel nanobridge structures by reverse nanostencil lithography using an edge-patterned stencil

Park¹,

Vazquez-Mena

Brugger

2006

Nanotechnology

Self Cite

View full text Add to dashboard Cite

We propose a new process for forming parallel nanobridge patterns by nanostencil lithography. In this process, a low-stress silicon nitride stencil with parallel nanobridge structures is fabricated by a new edge patterning technique where those nanobridges are formed simultaneously via sidewall features using the conventional photolithography and anisotropic dry etching process. After forming primary Cr patterns on the oxidized Si substrate by depositing Cr through the edge-patterned stencil, those patterns are transferred onto the underlying Si layer in a reversed manner, leading to the formation of parallel Cr nanobridge patterns on the Si substrate. Using this process, we have successfully produced 85 nm-wide parallel Cr nanobridge patterns from a stencil with 115 nm-wide nanobridge structures that was fabricated by conventional microlithography. As there is no need for advanced lithography techniques in preparing the nanobridge stencil, the combination of the edge patterning and reverse nanostencil process provides a cost-effective tool for the massive fabrication of parallel nanobridge arrays at the 100 nm scale.

show abstract

“…A more simplistic and inexpensive approach to patterning involves utilizing areaselective deposition through a shadow mask or stencil in which a metal (or alternative materials) can be evaporated or sputtered directly onto the sample in a desired pattern. Flat and rigid masks typically made from silicon nitride membranes have been reported to form, for example, tunnel junctions [2] or repeating micro/nanoscale structures [3][4][5]. Moreover, other alternative techniques to employ polymeric based masks for patterned deposition have also been proposed [6,7].…”

Section: Introductionmentioning

confidence: 99%

Silicon shadow mask fabrication for patterned metal deposition with microscale dimensions using a novel corner compensation scheme

Apanius¹,

Kaul

Abramson

2007

Sensors and Actuators A: Physical

View full text Add to dashboard Cite

Fabrication of metallic patterns by microstencil lithography on polymer surfaces suitable as microelectrodes in integrated microfluidic systems

Cited by 27 publications

References 29 publications

Nanoscale Patterning and Electronics on Flexible Substrate by Direct Nanoimprinting of Metallic Nanoparticles

Nanoscale Patterning and Electronics on Flexible Substrate by Direct Nanoimprinting of Metallic Nanoparticles

Patterning of parallel nanobridge structures by reverse nanostencil lithography using an edge-patterned stencil

Silicon shadow mask fabrication for patterned metal deposition with microscale dimensions using a novel corner compensation scheme

Contact Info

Product

Resources

About