Fabrication of micro-mold for glass embossing using focused ion beam, femto-second laser, eximer laser and dicing techniques

Youn, Sung-Won; Takahashi, Masaharu; Okuno, Hiroshi G.; Maeda, Ryutaro

doi:10.1016/j.jmatprotec.2006.11.120

Cited by 51 publications

(24 citation statements)

References 13 publications

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“…of the microcavities. 71,72 In this section FIB sputtering is presented as an efficient way to fabricate LIGA competitive microcavity economically.…”

Section: Microcavity For Replicationmentioning

confidence: 99%

A review of focused ion beam sputtering

Ali

Hung

2010

Int. J. Precis. Eng. Manuf.

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NOMENCLATURE η = atomic density α = coefficient of energy transfer φ = ion flux η = atomic density of the target σ = standard deviation δ = pixel spacing (nm) (distance between two adjacent beam centres) φ (x,y) = ion flux at point (x, y) ε b = bonding energy per atom pair ∆Z ij = sputtering depth at each point (x i , y i ), a = peak-to-valley height of the variable cumulative intensity profile A = aperture size (nm) B = beam function d = ion dose f x,y = energy density function of Gaussian beam in two dimensions I = total ion beam current J(x,y) = beam current intensity at any point x,y J 0 = peak current intensity (at the centre of the beam) K 1 , K 2 = material factor for different crystalline structure, and other properties respectively M = material function m i , m t = atomic mass of the incident (sputtering) ion, and target material respectively MRR = material removal rate R = function representing the sputtered surface profile r = FIB radius (nm) R a , R max = average and maximum (peak-to-valley height) surface roughness respectively S(θ) = angle dependant sputtering yield T C = critical dwell time or sputtering time T d = dwell time t x,y = dwell time in second of the ion beam at point (x i , y j ) U 0 = atomic binding energy V = acceleration voltage Y(E) = normal sputtering yield z = sputtered depth Z i , Z t = nuclear charge of the incident ion and target atom respectively This paper reviews the applications of focused ion beam (FIB) sputtering for micro/nano fabrication. Basic principles of FIB were briefly discussed, and then empirical and fundamental models for sputtering yield, material removal rate, and surface roughness were presented and compared. The empirical models were more useful for application compared to fundamental models. Fabrication of various micro and nano structures was discussed. Trimmed atomic force microscope (AFM) tips were tested in measurement and imaging of high aspect ratio nanopillars where higher accuracy and clarity were observed. Micromilling tool fabricated using FIB sputtering was used to machine microchannels. Slicing and dwell time control approaches on FIB sputtering were presented for the fabrication of three dimensional microcavities. The first approach is preferred for practical applications.The maximum aspect ratio of 13:1 of the microstructures was achieved. The minimum size of the nanopore was in the range of 2-10 µm. Cavities of microgear of 70 µm outside diameter were sputtered with submicrometer accuracy and 2-5 nm average surface roughness. The microcavities were then filled with polymer in a subsequent micromodling process. The replicated microcomponents were inspected with scanning electron microscope where faithful duplication of accuracy and surface texture of the cavity was observed.

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“…of the microcavities. 71,72 In this section FIB sputtering is presented as an efficient way to fabricate LIGA competitive microcavity economically.…”

Section: Microcavity For Replicationmentioning

confidence: 99%

A review of focused ion beam sputtering

Ali

Hung

2010

Int. J. Precis. Eng. Manuf.

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“…Nonconventional machining, or hybrid machining methods, are also possible alternatives to the diamond cutting method in generating large feature sized microstructures on brittle materials. Youn et al [19] demonstrated the possibility of using focused ion beam (FIB) milling to produce microstructures with good surface quality (Ra = 4–30 nm) on glassy carbon though the efficiency is very low. Kim et al [20] successfully fabricated a lenticular lens fused silica mold, which was then used for polymer replication by a combined method of femtosecond laser milling and CO 2 laser polishing.…”

Section: Introductionmentioning

confidence: 99%

Machining of Lenticular Lens Silicon Molds with a Combination of Laser Ablation and Diamond Cutting

Han

Lee

2019

Micromachines

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Lenticular lenses are widely used in the three-dimensional display industry. Conventional lenticular lens components are made of plastics that have low thermal stability. An alternative is to use glass to replace plastic as the lenticular lens component material. Single crystal silicon is often used as the mold material in the precision glass molding process. It is, however, difficult to fabricate a lenticular lens silicon mold that has a large feature size compared to the critical depth of cut of silicon. In order to solve the problems of machining lenticular lens silicon molds using the conventional diamond cutting method, such as low machining efficiency and severe tool wear, a hybrid machining method that combined laser ablation and diamond cutting was proposed. A feasibility study was performed to investigate the possibility of using this method to fabricate a lenticular lens silicon mold. The influence of the laser parameters and machining parameters on the machining performance was investigated systematically. The experimental results indicated that this hybrid machining method could be a possible method for manufacturing lenticular lens silicon molds or other similar microstructures.

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“…(Tseng 2004;Youn et al 2007). Compared to other laser technique, the main advantage of this laser technique is that the short pulse duration leads to high peak power intensities that make the process quick and with very small heataffected zone (HAZ), in additional, the laser technique used in this study has higher aspect ratio than other laser techniques.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of large-area microfluidics structures on glass by imprinting and diode-pumped solid state laser writing techniques

Chen

Maccioni

et al. 2011

Microsyst Technol

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A micro structured master prototype for imprint lithography in glass has been successfully fabricated by using a Q-switched Nd:YVO 4 Diode-pumped solid state laser writing in Nickel-based alloy. The micro-structures in the prototype were characterized using an optical microscope, scanning electron microscopy, surface profilometer and field emission scanning electron microscopy. The surface quality of the fabricated master prototype was further improved through the process of polishing and cleaning. Then the master prototype was used for imprinting a soda lime glass substrate under the optimized imprinting conditions that have been previously studied for lab-on-chip devices. The results showed that very good quality transfer of the micro structures from the prototype master to the glass substrate was obtained.

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Fabrication of micro-mold for glass embossing using focused ion beam, femto-second laser, eximer laser and dicing techniques

Cited by 51 publications

References 13 publications

A review of focused ion beam sputtering

A review of focused ion beam sputtering

Machining of Lenticular Lens Silicon Molds with a Combination of Laser Ablation and Diamond Cutting

Fabrication of large-area microfluidics structures on glass by imprinting and diode-pumped solid state laser writing techniques

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