Fabrication of micro/nano-structures using focused ion beam implantation and XeF<sub>2</sub>gas-assisted etching

Xu, Zongwei; Fu, Yongqi; Zhang, S J; Han, Tielong; Li, J M

doi:10.1088/0960-1317/19/5/054003

Cited by 35 publications

(12 citation statements)

References 15 publications

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“…The subsurface damages such as phase transformation [ 3 ], dislocation mobility [ 4 ], and even local atom disarrangement [ 5 ] can be observed directly by TEM characterization. Other destructive methods include etching [ 6 ], cross-sectional observation [ 7 ], angle lapping [ 8 ], and so on. However, these methods destroy the sample and sometimes the sample preparation is time-consuming, which limits the wide application of these methods.…”

Section: Introductionmentioning

confidence: 99%

Topic Review: Application of Raman Spectroscopy Characterization in Micro/Nano-Machining

Song

et al. 2018

Micromachines

135

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The defects and subsurface damages induced by crystal growth and micro/nano-machining have a significant impact on the functional performance of machined products. Raman spectroscopy is an efficient, powerful, and non-destructive testing method to characterize these defects and subsurface damages. This paper aims to review the fundamentals and applications of Raman spectroscopy on the characterization of defects and subsurface damages in micro/nano-machining. Firstly, the principle and several critical parameters (such as penetration depth, laser spot size, and so on) involved in the Raman characterization are introduced. Then, the mechanism of Raman spectroscopy for detection of defects and subsurface damages is discussed. The Raman spectroscopy characterization of semiconductor materials’ stacking faults, phase transformation, and residual stress in micro/nano-machining is discussed in detail. Identification and characterization of phase transformation and stacking faults for Si and SiC is feasible using the information of new Raman bands. Based on the Raman band position shift and Raman intensity ratio, Raman spectroscopy can be used to quantitatively calculate the residual stress and the thickness of the subsurface damage layer of semiconductor materials. The Tip-Enhanced Raman Spectroscopy (TERS) technique is helpful to dramatically enhance the Raman scattering signal at weak damages and it is considered as a promising research field.

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Section: Introductionmentioning

confidence: 99%

Topic Review: Application of Raman Spectroscopy Characterization in Micro/Nano-Machining

Song

et al. 2018

Micromachines

135

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“…For example, carbon nanotube (CNT) can be fixed to the end of ordinary probe of atomic force microscope by the FIBID process combining with the nanomanipulations, as shown in Fig. 24 (Xu et al 2009a). Another application of FIBID is to fabricate three-dimensional (3D) microstructures/nanostructures.…”

Section: Fib-induced Depositionmentioning

confidence: 99%

“…The ion-nucleus scattering and ion-electron scattering process would be in as timescale, while the defect clusters and dislocations would be formed in ns timescale (Whitlow and Zhang 2010). The FIBI layer after XeF 2 gas flow eliminating the redeposition (Xu et al 2009a) Handbook…”

Section: • Defect Clusters and Amorphous Regionsmentioning

confidence: 99%

Focused Ion Beam Nanofabrication Technology

Xu¹,

Zeng²

2013

Handbook of Manufacturing Engineering and Technology

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Focused ion beam has become an increasingly popular tool for the manufacturing of various types of micro-/nanostructures and devices for different applications. In this chapter, the recent developments of the FIB technologies in the micro/nano manufacturing are presented in details. FIB technologies mainly involve four main approaches: imaging, milling, ion-induced deposition, and implantation. The working principle and key techniques underlying the four approaches are introduced with an emphasis on their abilities in micro-/nanofabrications. The application fields involving using the FIB micro-/nanofabrication technologies are also presented, such as micro optical elements, plasmonic lenses, etc. Concluding remarks and outlook of the future research on the FIB technologies in micro/nano manufacturing are provided at the end of the chapter.

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“…are the few of many innovative applications of FIB. [40][41][42] SIMS technique, TEM sample preparation, high aspect ratio microstructures, and several other micro/nano structures fabrication are discussed in the following subsections. The overall sizes of these components are in the range from submicrometer to few hundreds of micrometers.…”

Section: Application Of Fib Sputteringmentioning

confidence: 99%

A review of focused ion beam sputtering

Ali

Hung

2010

Int. J. Precis. Eng. Manuf.

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NOMENCLATURE η = atomic density α = coefficient of energy transfer φ = ion flux η = atomic density of the target σ = standard deviation δ = pixel spacing (nm) (distance between two adjacent beam centres) φ (x,y) = ion flux at point (x, y) ε b = bonding energy per atom pair ∆Z ij = sputtering depth at each point (x i , y i ), a = peak-to-valley height of the variable cumulative intensity profile A = aperture size (nm) B = beam function d = ion dose f x,y = energy density function of Gaussian beam in two dimensions I = total ion beam current J(x,y) = beam current intensity at any point x,y J 0 = peak current intensity (at the centre of the beam) K 1 , K 2 = material factor for different crystalline structure, and other properties respectively M = material function m i , m t = atomic mass of the incident (sputtering) ion, and target material respectively MRR = material removal rate R = function representing the sputtered surface profile r = FIB radius (nm) R a , R max = average and maximum (peak-to-valley height) surface roughness respectively S(θ) = angle dependant sputtering yield T C = critical dwell time or sputtering time T d = dwell time t x,y = dwell time in second of the ion beam at point (x i , y j ) U 0 = atomic binding energy V = acceleration voltage Y(E) = normal sputtering yield z = sputtered depth Z i , Z t = nuclear charge of the incident ion and target atom respectively This paper reviews the applications of focused ion beam (FIB) sputtering for micro/nano fabrication. Basic principles of FIB were briefly discussed, and then empirical and fundamental models for sputtering yield, material removal rate, and surface roughness were presented and compared. The empirical models were more useful for application compared to fundamental models. Fabrication of various micro and nano structures was discussed. Trimmed atomic force microscope (AFM) tips were tested in measurement and imaging of high aspect ratio nanopillars where higher accuracy and clarity were observed. Micromilling tool fabricated using FIB sputtering was used to machine microchannels. Slicing and dwell time control approaches on FIB sputtering were presented for the fabrication of three dimensional microcavities. The first approach is preferred for practical applications.The maximum aspect ratio of 13:1 of the microstructures was achieved. The minimum size of the nanopore was in the range of 2-10 µm. Cavities of microgear of 70 µm outside diameter were sputtered with submicrometer accuracy and 2-5 nm average surface roughness. The microcavities were then filled with polymer in a subsequent micromodling process. The replicated microcomponents were inspected with scanning electron microscope where faithful duplication of accuracy and surface texture of the cavity was observed.

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Fabrication of micro/nano-structures using focused ion beam implantation and XeF₂gas-assisted etching

Cited by 35 publications

References 15 publications

Topic Review: Application of Raman Spectroscopy Characterization in Micro/Nano-Machining

Topic Review: Application of Raman Spectroscopy Characterization in Micro/Nano-Machining

Focused Ion Beam Nanofabrication Technology

A review of focused ion beam sputtering

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Fabrication of micro/nano-structures using focused ion beam implantation and XeF2gas-assisted etching

Cited by 35 publications

References 15 publications

Topic Review: Application of Raman Spectroscopy Characterization in Micro/Nano-Machining

Topic Review: Application of Raman Spectroscopy Characterization in Micro/Nano-Machining

Focused Ion Beam Nanofabrication Technology

A review of focused ion beam sputtering

Contact Info

Product

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Fabrication of micro/nano-structures using focused ion beam implantation and XeF₂gas-assisted etching