2019
DOI: 10.3390/ma12162640
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Fabrication of Micro-Punch Array by Plasma Printing for Micro-Embossing into Copper Substrates

Abstract: Copper substrates were wrought to have micro-grooves for packaging by micro-stamping with use of a AISI316 stainless steel micro-punch array. The micro-texture of this arrayed punch was first tailored and compiled into CAD data. A screen film was prepared to have the tailored micro-pattern in correspondence to the CAD data. A negative pattern to this screen was printed directly onto the AISI316 die substrate. This substrate was plasma nitrided at 673 K for 14.4 ks. The unprinted die surfaces were selectively n… Show more

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Cited by 3 publications
(1 citation statement)
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“…The paper on the fabrication of a micro-punch array by plasma printing for micro-embossing into copper substrates was prepared by Shiratori et al [ 41 ]. Copper substrates were wrought to have micro-grooves for packaging by micro-stamping with the use of an AISI316 stainless steel micro-punch array.…”
mentioning
confidence: 99%
“…The paper on the fabrication of a micro-punch array by plasma printing for micro-embossing into copper substrates was prepared by Shiratori et al [ 41 ]. Copper substrates were wrought to have micro-grooves for packaging by micro-stamping with the use of an AISI316 stainless steel micro-punch array.…”
mentioning
confidence: 99%