Fabrication of micromotors using LIGA process

Takimoto, Shinya; Kondo, Rieko; Suzuki, Kô; Saito, Susumu

doi:10.1109/mhs.1999.820009

Cited by 11 publications

(7 citation statements)

References 3 publications

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“…Many processes have been developed to form high aspect ratio comb drive structures including the SCREAM process [16], the dissolved wafer process [17], the etch-diffusion process [18], the surface/bulk micromachining process [19], and molding processes such as LIGA [20] and HEXIL [21]. The high aspect ratio device described in this paper was constructed by a simple and high-yield fabrication process using DRIE on SOI wafers [13].…”

Section: Mems Microforce Sensingmentioning

confidence: 99%

“…A similar process, the DRIE and sealed cavity wafer bonding process, was earlier reported [15], [22], [23] in which cavities are etched on a handle layer Si substrate before fusion bonding so that the structures on the device layer can be suspended after release. In order to reduce the pressure inside the cavities, fusion bonding was required to be done either in an oxygen-rich ambient [22] or in a vacuum if the device layer Si is thinner than 20 . In this process [13], the handle layer Si substrate does not need to be patterned before fusion bonding.…”

Section: Mems Microforce Sensingmentioning

confidence: 99%

See 1 more Smart Citation

Characterizing fruit fly flight behavior using a microforce sensor with a new comb-drive configuration

Sun

Fry

Potasek

et al. 2005

J. Microelectromech. Syst.

128

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Abstract-This paper reports a MEMS microforce sensor with a novel configuration of bulk micromachined differential triplate comb drives that overcomes the difficulty of electrically isolating the two stationary capacitor comb sets in bulk micromachining. A high-yield fabrication process using deep-reactive ion etching (DRIE) on silicon-on-insulator (SOI) wafers and only three lithographic masks was utilized to construct the high aspect ratio devices. The process features dry release of both suspended structures and the entire device in order to protect fragile components.The sensor has a high sensitivity (1.35 mV N), good linearity ( 4%), and a large bandwidth (7.8 kHz), and is therefore well suited for characterizing flight behavior of fruit flies (Drosophila melanogaster). The technique allows for the instantaneous measurement of flight forces, which result from a combination of aerodynamic forces and inertial forces generated by the wings, and demonstrates a novel experimental paradigm for exploring flight biomechanics in the fruit fly. The average lift force is determined to be 9.3 N ( 2.3 N),whichisintherange of typical body weights of fruit flies. The potential impact of this research extends beyond gathering flight data on Drosophila melanogaster by demonstrating how MEMS technology can be used to provide valuable tools for biomechanical investigations.[1208]Index Terms-Capacitive sensor, deep-reactive ion etching (DRIE) on silicon-on-insulator (SOI), dice free dry release, differential triplate comb drive, Drosophila melanogaster, fruit flies, high aspect ratio, microforce sensing.

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Section: Mems Microforce Sensingmentioning

confidence: 99%

Section: Mems Microforce Sensingmentioning

confidence: 99%

Characterizing fruit fly flight behavior using a microforce sensor with a new comb-drive configuration

Sun

Fry

Potasek

et al. 2005

J. Microelectromech. Syst.

128

View full text Add to dashboard Cite

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“…Drive systems, in particular, rotating electrostatic micromotors are fabricated by surface micromachining using polysilicon with a thickness of only a few micrometers. The LIGA method and PMMA (polymethyl methacrylate) molds can be used to fabricate the wobble micromotor [63]. In addition, the polysilicon center pin process, the polysilicon flange process, the selective CVD tungsten process, the diamond-like carbon (DLC) process, the LIGA process with sacrificial layer, and the three-mask tungsten process have been published for the fabrication of electrostatic micromotors [64][65][66][67].…”

Section: Reasonable Designsmentioning

confidence: 99%

Electrostatic micromotor and its reliability

Zhang

Meng

2005

Microelectronics Reliability

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“…"Micromachining" is the key technology for the fabrication of solid-state MEMS devices such as microsensors and miroactuators. These technologies are: bulkmicromachining, surface-micromachining [46] and micromoulding technologies including classical electroplating, the HexSil [47], and the LIGA [48][49] processes.…”

Section: Mems Fabrication Technologymentioning

confidence: 99%

Development of silicon-on-glass electrostatic microactuators with a high aspect ratio and vertical configuration

Chen¹

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Actuators are the key components that produce the mechanical output and perform physical functions of particular systems. Electrostatic actuators are widely used in micro-electromechanical systems (MEMS) applications for their combining versatility and simple technology. In this thesis, an electrostatic microactuator fabricated on silicon-on-glass (SOG) is studied. The electrostatic microactuator utilizes a vertical configuration of comb-drive working plane to the mounting plane of driving components, which are different from the planar configuration of comb drives. The vertical configuration provides more space area for more comb drives to be arrayed, making low driving voltage possible. The electrostatic microactuators have high-aspect-ratio structure, high structural strength, and low cost. The proposed microactuator can be used in the hard disk drives (HDD) to meet their high-capacity and high-performance trend. The microactuator can be used as a dual-stage actuator in the head-positioning system to move the magnetic heads, while providing high speed and accuracy of the positioning. To fulfill the high-bandwidth and high-accuracy requirements of the electrostatic actuators, the flexures that support the microactuator should have a high stiffness and at the same time be flexible enough to have the desired displacement in the operational direction. The straight-beam, folded-beam, symmetric-quad and asymmetric-quad flexures were studied. The analytical and finite element analysis proved that the symmetric-quad flexure has the highest stiffness among the four flexures. Fabrication of the electrostatic microactuator was realized by using silicon-on-glass wafer process. The fabrication started with a 200um-thick n-type silicon wafer, and then bonded to a Pyrex glass substrate, and finally the comb structures were formed by high-anisotropy deep reactive ion etching (DRIE) technique. The fabrication processes II ATTENTION: The Singapore Copyright Act applies to the use of this document. Nanyang Technological University Library of glass deep wet etching, wafer bonding and high-aspect-ratio DRIE have been developed. This SOG process is alternative to the SOI process for some applications but at a much lower cost. The prototypes of the microactuators were characterized. With a driving voltage of 40 V, the microactuators with straight flexures, folded flexures and asymmetric-quad flexures have the displacement of 0.94 um, 1.73 um and 0.26 um, respectively. They have the primary resonant frequency of 7.2 kHz, 5.89 kHz and 15.85 kHz, respectively. The characterization results were compared and discussed with the theoretical results. The fabrication process, especially the DRIE process, generated various geometrical tolerances of the comb drive actuators, basically including the profile tolerance and undercut tolerance. Studies showed that these fabrication influences have significant impact on the device performance, such as the electrostatic force, flexure stiffness, displacement and quality factor. The study also shows t...

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Fabrication of micromotors using LIGA process

Cited by 11 publications

References 3 publications

Characterizing fruit fly flight behavior using a microforce sensor with a new comb-drive configuration

Characterizing fruit fly flight behavior using a microforce sensor with a new comb-drive configuration

Electrostatic micromotor and its reliability

Development of silicon-on-glass electrostatic microactuators with a high aspect ratio and vertical configuration

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