Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process)

Becker, E. W.; Ehrfeld, W.; Hagmann, Patric; Maner, A.; Münchmeyer, D.

doi:10.1016/0167-9317(86)90004-3

Cited by 980 publications

(386 citation statements)

References 4 publications

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“…There are many different methods, such as photolithography [1], LIGA [2], FIB (Focused Ion Beam) technology [3], nanoimprint [4] and tip based nanomanufacturing (TBN) [5]. Among all of these methods, every technique has its own advantages and special applications, but the tip based micro/nano machining is attracting more and more attention for the low-cost, simple operation and high accuracy.…”

Section: Introductionmentioning

confidence: 99%

Experimental investigation of the tip based micro/nano machining

Guo

Tian

Liu

et al. 2017

Applied Surface Science

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Based on the self-developed three dimensional micro/nano machining system, the effects of machining parameters and sample material on micro/nano machining are investigated. The micro/nano machining system is mainly composed of the probe system and micro/nano positioning stage. The former is applied to control the normal load and the latter is utilized to realize high precision motion in the xy plane. A sample examination method is firstly introduced to estimate whether the sample is placed horizontally. The machining parameters include scratching direction, speed, cycles, normal load and feed. According to the experimental results, the scratching depth is significantly affected by the normal load in all four defined scratching directions but is rarely influenced by the scratching speed. The increase of scratching cycle number can increase the scratching depth as well as smooth the groove wall. In addition, the scratching tests of silicon and copper attest that the harder material is easier to be removed. In the scratching with different feed amount, the machining results indicate that the machined depth increases as the feed reduces. Further, a cubic polynomial is used to fit the experimental results to predict the scratching depth. With the selected machining parameters of scratching direction d3/d4, scratching speed 5μm/s and feed 0.06μm, some more micro structures including stair, sinusoidal groove, Chinese character "田", "TJU" and Chinese panda have been fabricated on the silicon substrate.

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Section: Introductionmentioning

confidence: 99%

Experimental investigation of the tip based micro/nano machining

Guo

Tian

Liu

et al. 2017

Applied Surface Science

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“…Palmer (62) with emphasis on electro-discharge machining. A parallel effort is in progress by Henke (13) with emphasis on fabrication by deep X-ray lithography, "LIGA" (63), following work of Kang, et al (64). Silicon processing technology was the first to show promise in this area (65) and may point the way to still higher frequencies.…”

Section: Advanced Structure Conceptsmentioning

confidence: 99%

Ultimate gradient in solid-state accelerators

Whittum

1999

AIP Conference Proceedings

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We recall the motivation for research in high-gradient acceleration and the problems posed by a compact collider. We summarize the phenomena known to appear in operation of a solid-state structure with large fields, and research relevant to the question of the ultimate gradient. We take note of new concepts, and examine one in detail, a miniature particle accelerator based on an active millimeter-wave circuit and parallel particle beams. Baltimore, Maryland July 5-11, 1998 Work supported by U.S. Abstract. We recall the motivation for research in high-gradient acceleration and the problems posed by a compact collider. We summarize the phenomena known to appear in operation of a solid-state structure with large fields, and research relevant to the question of the ultimate gradient. We take note of new concepts, and examine one in detail, a miniature particle accelerator based on an active millimeter-wave circuit and parallel particle beams. Invited talk presented at the 8th Workshop on Advanced Accelerator Concepts

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“…There are three main approaches: (1) subtractive patterning by etching deep trenches into a hard material, often silicon or diamond, using a masking layer on top (resist or hard mask) and HAR nanopores in anodic alumina (AAO) via a self-limiting etching process [16][17][18][19][20][21] , as well as polymers that have been exposed to photons or electrons through a mask or by a scanning beam and are subsequently wet developed 14,[22][23][24][25][26] . Ablation via laser is a direct subtractive method for patterning substrates 27 .…”

Section: High-aspect-ratio Microstructures (Harms)mentioning

confidence: 99%

High-aspect-ratio nanoimprint process chains

et al. 2017

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Different methods capable of developing complex structures and building elements with high-aspect-ratio nanostructures combined with microstructures, which are of interest in nanophotonics, are presented. As originals for subsequent replication steps, two families of masters were developed: (i) 3.2 μm deep, 180 nm wide trenches were fabricated by silicon cryo-etching and (ii) 9.8 μm high, 350 nm wide ridges were fabricated using 2-photon polymerization direct laser writing. Both emerging technologies enable the vertical smooth sidewalls needed for a successful imprint into thin layers of polymers with aspect ratios exceeding 15. Nanoridges with high aspect ratios of up to 28 and no residual layer were produced in Ormocers using the micromoulding into capillaries (MIMIC) process with subsequent ultraviolet-curing. This work presents and balances the different fabrication routes and the subsequent generation of working tools from masters with inverted tones and the combination of hard and soft materials. This provides these techniques with a proof of concept for their compatibility with high volume manufacturing of complex micro-and nanostructures.Keywords: cryo-etching; direct 6 write laser lithography; high aspect ratio; moulding; nanoimprint lithography; Ormocer; photonic nanofences; 2-photon polymerization INTRODUCTION High-aspect-ratio microstructures (HARMS), that is, structures with a large height/width ratio, have found many applications 1,2 such as X-ray gratings 3 , gas chromatography columns 4 , magnetic coils 5 , X-ray telescopes 6 , micro-gears 7 , micro-capacitors with highaspect-ratio (HAR) cantilevers 8 , and micromechanical and microoptical elements 9,10 . These structures exhibit aspect ratios (ARs) of over 10 and almost vertical sidewalls, making them much more challenging to develop than the structures typically used in planar technology with moderate ARs of 1 to 2. They are therefore characterized by an intermediate state between two-and threedimensional (2D and 3D), that is, a 2D planar design that is extended into the vertical dimension and often called . There are several methods to produce HAR structures on typical planar substrates, most of them relying on the anisotropy of subtractive pattern transfer of a low AR masking layer into an underlying resist or substrate, that is, by using mask based ultraviolet (UV)-photolithography (PL) with an AR up to 5, silicon etching (for example, dry etching) with an AR up to 20, and direct write laser lithography (DWL) and X-ray lithography with ARs 420 (Refs. 12-15). These methods are continually being improved to produce a higher AR and smaller lateral dimensions. Furthermore, they are enlarged by new techniques that are often subsets of etching processes with different advantages and disadvantages. One of those challenges is the suitability for submicron and nanopatterning, that is, structures with lateral sizes much smaller than 1 μm and the possibility to combine micro-with nanostructures in the same material.There are three main approaches: (1)...

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Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process)

Cited by 980 publications

References 4 publications

Experimental investigation of the tip based micro/nano machining

Experimental investigation of the tip based micro/nano machining

Ultimate gradient in solid-state accelerators

High-aspect-ratio nanoimprint process chains

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