Fabrication of $\mu\ \text{TEGs}$ Based on Nano-Scale Thermoelectric Material Dispersions

Subhash, Swathi Krishna; Gerach, Timo; Sherkat, Negin; Hillebrecht, Harald; Woias, Peter; Pelz, Uwe

doi:10.1109/transducers50396.2021.9495526

Cited by 4 publications

(7 citation statements)

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“…The most obvious and cost saving one being the omission of any kind of cleanroom manufacturing processes, used by all MEMS-based µTEG fabrication methods [6,7]. The use of a CNC mill for the thermoleg cavity formation and for substrate patterning has additional advantages over previous multi-step laser and photolithography processes [10]. Fifteen substrates for 8-TC-µTEGs can now be built in just 2 h, whereas the laser requires several hours [10].…”

Section: µTeg Output Results and Discussionmentioning

confidence: 99%

“…The heat source's output is set to 1000 W m −2 which corresponds to 0.2 W on the 2.25 cm 2 of the 8-TC-µTEG, to create a 7.8 K temperature difference between the top and bottom sides of the µTEG. The material parameters were derived using material characterization measurements of a comparable µTEG made of the same TE materials in order to be able to practically validate the results [10]. The simulated TE materials (Bi 0.5 Sb 1.5 Te 3 as p-type and Bi 2 Te 2.7 Se 0.3 as n-type) were identical to the ones used later in section 3.1.…”

Section: µTeg Design and Simulationmentioning

confidence: 99%

“…To avoid oxidation, every step of the material preparation and extraction was carried out under N 2 atmosphere [10].…”

Section: Te Materials Fabricationmentioning

confidence: 99%

“…A PCB substrate is used to reduce processing time and adapt to a low-cost mass production process. Instead of using a laser cutter as shown in the literature [10], µTEG substrates are prepared with a computer numerical control (CNC) machine (CCD/2, Bungard Electronik GmbH, Germany).…”

Section: µTeg Fabricationmentioning

confidence: 99%

“…This papers focus is on cost-effective fabrication procedures based on printed circuit device technology in order to reduce design complexity and minimize fabrication effort [9]. This paper focuses on improving a µTEG manufacturing technique based on nano-scale TE material dispensing, which was previously published [10]. Simulation methods for estimating the TE performance of a dedicated µTEG design are crucial in the development of TEGs [11].…”

Section: Introductionmentioning

confidence: 99%

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Fabrication and simulation study for vertical micro-TEGs based on printed circuit board manufacturing processes

Sherkat

Sivaprasad²,

Pelz³

et al. 2022

Smart Mater. Struct.

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The development of fabrication procedures for micro-thermoelectric generators (µTEGs) based on low-cost fabrication technologies, appropriate for mass production is discussed and demonstrated in this study. Simulations were carried out, two manufacturing processes were tested, and device performance is compared to simulation results for vertical µTEGs. The substrate for this device is a printed circuit board (PCB), and the thermoelectric materials are self-developed Bi0.5Sb1.5Te3 (p-type) and Bi2Te2.7Se0.3 (n-type) pastes. A square µTEG (15 mm × 15 mm × 500 µm) with eight thermocouples (TC) was fabricated. The characterization of the fabricated 8-TC-µTEG was carried out and a power output of 1.23 µW was obtained for the fabricated 8-TC-µTEG. The measurement results of this 8-TC-µTEG closely match simulation results as well. Moreover, a novel vertical electrical contact resistance measurement setup is designed and implemented into the final evaluation of micro-thermoelectric generator production to have a more accurate assessment. The simulation study is also applied for the designed electrical contact resistance measurement setup. As a result, the contact resistivity of Bi2Te3/Cu was calculated as 5.65 × 10−4 Ωcm2.

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