Fabrication of Multilayer Interconnection Using Ultraviolet Nanoimprint Lithography

Ono, Hironaga; Shoji, Shuichi; Mizuno, Jun; Saito, Mikiko

doi:10.1109/inss.2007.4297406

Cited by 2 publications

(1 citation statement)

References 5 publications

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“…Then, the seed layer was exposed, and via and trench patterns were deposited by Cu electroplating. 7,8) The condition of Cu electroplating are shown in Table I. Finally, excess electroplated Cu was flattened by chemical mechanical planarization (CMP).…”

Section: Fabricationmentioning

confidence: 99%

Copper Multilayer Interconnection Using Ultravaiolet Nanoimprint Lithography with a Double-Deck Mold and Electroplating

Nagai

Ono

Sakuma

et al. 2009

Jpn. J. Appl. Phys.

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This paper presents an analysis of several in-water algorithms developed using a large number of bio-optical data collected in Korean and neighbouring ocean waters. The upward and downward light fields measured in these waters were normalized to provide remote sensing reflectance (R rs ) from which the variations in sun-induced chlorophyll-a (Chl-a) fluorescence from phytoplankton biomass were analysed and the fluorescence line height ( Flu) was measured using a baseline method. Flu measurements were related to in situ Chl-a concentrations (used as an index for quantifying the algal material) to obtain the Flu(681), Flu(688) and Flu (area) algorithms, which were compared with those from standard spectral ratios of the remote sensing reflectance, R rs (444)/R rs (554) and R rs (490)/R rs (554). Comparison revealed the correlation coefficients (r 2 ) 0.88-0.90 for the fluorescence algorithms and 0.79-0.85 for the spectral ratios algorithms. A validation analysis using a new data set illustrated the merits of these algorithms in Case II waters. Fluorescence-based algorithms tended to reproduce in situ Chl-a concentrations (from 0.1 to 82 mg m −3 ), whereas standard spectral ratios algorithms gave inconsistent estimates, probably caused by the interference of inorganic sediment and dissolved organic matter in these waters. For measurements of the sun-induced Chl-a fluorescence signal in coastal waters, this study discusses the requirements and provides the optimal channels to be adopted in the design of the new generation ocean colour sensors planned in the near future.

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Section: Fabricationmentioning

confidence: 99%

Copper Multilayer Interconnection Using Ultravaiolet Nanoimprint Lithography with a Double-Deck Mold and Electroplating

Nagai

Ono

Sakuma

et al. 2009

Jpn. J. Appl. Phys.

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Scratch properties of nickel thin films using atomic force microscopy

Tseng

Shirakashi

Jou

et al. 2010

Journal of Vacuum Science &Amp; Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phen

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In vivo nanomechanical imaging of blood-vessel tissues directly in living mammals using atomic force microscopy Appl. Phys. Lett. 95, 013704 (2009); Experiments using atomic force microscopy ͑AFM͒ as a machining tool for scratching patterns on nickel thin films have been conducted with an emphasis on establishing the material scratchability or more general, the nanoscale machinability. The effects of the scratch parameters, including the applied tip force and scratch direction, on the size of the scratched geometry were investigated. The primary factors that measure the scratchability were then assessed. The scratchability of Ni as compared to that of Si was specifically evaluated and discussed. A stress-hardness analysis was also performed to further validate the experimental and correlation results. All results indicate that the Ni thin film possesses excellent scratchability and one order of magnitude higher than that of Si. Based on the correlation formula developed, Ni should be able to be precisely scratched by AFM tip with the required dimension and nanoscale accuracy and precision.

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Fabrication of Multilayer Interconnection Using Ultraviolet Nanoimprint Lithography

Cited by 2 publications

References 5 publications

Copper Multilayer Interconnection Using Ultravaiolet Nanoimprint Lithography with a Double-Deck Mold and Electroplating

Copper Multilayer Interconnection Using Ultravaiolet Nanoimprint Lithography with a Double-Deck Mold and Electroplating

Scratch properties of nickel thin films using atomic force microscopy

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