Fabrication of polyimide composite films based on carbon black for high‐temperature resistance

Abstract

A novel high-performance material, carbon black (CB) polyimide (PI), was obtained by the chemical synthesis of CB (carbon black N326) with PI. Following its synthesis, several analyses were carried out to investigate the thermal and mechanical properties of the newly synthesized CB-PI. The thermal decomposition temperature of CB-PI compared to PI increased by 76 C from 508 to 584 C. The glass transition temperature of CB-PI as evaluated by differential scanning calorimetry increased by 204 C from 379 to 583 C compared to that of PI. Moreover, the mechanical strength of CB-PI increased by 16% compared to that of PI. In addition, the analyses confirm that CB and PI in the synthesized CB-PI were chemically crosslinked, which was shown to be responsible for the superior thermal and mechanical properties of the CB-PI. POLYM. COMPOS., 35:2214-2220

Research Progress and Application of Polyimide-Based Nanocomposites

“…Solution blending is a method of dispersing nanomaterials into the corresponding solvent (DMF, PAA) of PAA and adding to the PAA solution or directly dispersing nanomaterials into the PAA solution, then obtaining PI composites after thermal imidization. Kwon et al [ 115 ] synthesized carbon black/PI (CB/PI) composites by this solution blending. The T d of CB-PI was increased by 76 °C, the T g was increased by 204 °C, and the mechanical strength was increased by 16% compared with pure PI, showing superior thermal and mechanical properties.…”

Preparation and tribological properties of polyimide/carbon sphere microcomposite films under seawater condition

“…Polyimide (PI) has very extraordinary comprehensive performance, such as excellent mechanical properties, high dielectric properties, prominent thermal endurance, acid-resistant and alkali-resistant properties, and good friction lubrication characteristics under low or high temperature [7,8]. However, it cannot be widely used as lubricant material because of its limited tribological performance.…”

Preparation and Properties of Inherently Black Polyimide Films with Extremely Low Coefficients of Thermal Expansion and Potential Applications for Black Flexible Copper Clad Laminates

“…Again, as in the case of black high-temperature resistant labels, black and electrical conductive additives are often introduced into the PI matrix so as to eliminate the effects of electrostatic charges on the printing process. However, in most of the microelectronic applications, the sacrifice of the Up to now, most of the black PI films have been developed by composite methodology, which is the combination of standard PI films with black additives, either with the inorganic ones, such as carbon black [21,22], carbon nanotube [23], and graphene [24], or with the organic black dyes. As we know, the inorganic black dyes or pigments are usually electrically conductive; thus, the derived black PI composite films usually exhibit reduced electrical resistivities.…”