Fabrication of PZT Thin Film on a Detachable Board and Its Adhesion Property

Honda, Fumiaki; Hosono, Toshifumi; Sueshige, Kazutaka; Fujino, Masataka; Suga, Tadatomo; Ichiki, Masaaki; Ito, Toshihiro

doi:10.1541/ieejsmas.133.b320

Cited by 2 publications

(4 citation statements)

References 4 publications

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“…As in a previous study, 11) Pb, Pt, and O were detected on the back of thin-films, and Pb, Si, and O were detected on the surface of SiO 2 by XPS analysis. Figures 10 and 11 show the relationships between ratio of Pb and the thickness of Pt.…”

Section: Xps Analysissupporting

confidence: 73%

“…Whether thin-films peel off or not is dependent on the adhesion strength of Pt to SiO 2 . 5) It was reported that Pb diffuses through Pt layers towards silicon substrates, [6][7][8][9][10][11] and diffused Pb between Pt and SiO 2 proved to be one of the factors for the variation in the adhesion strength in our previous study. 11) However, the amount of diffused Pb between Pt and SiO 2 according to the thickness of PZT layers (fabrication times), and whether the amount of Pb between Pt and SiO 2 is related to the variation in the adhesion strength.…”

Section: Introductionmentioning

confidence: 77%

“…It was confirmed that the adhesion strength increased with the amount of diffused Pb, as a previous study reported. 11) On the other hand, the adhesion strengths among the samples with diffused Pb (PZT: 250-2500 nm), were approximately around 2-4 MPa, even though they had different amounts of diffused Pb. From these results, it can be said that a small amount of Pb is needed to reinforce the adhesion strength, and excess diffused Pb has no effect on the reinforcement of the adhesion strength.…”

Section: Tensile Testsmentioning

confidence: 98%

See 2 more Smart Citations

Relationship between Diffusion and Adhesion Properties of Ferroelectric Thin-Film Structure on Releasable Substrate

Honda

Hosono

Fujino

et al. 2013

Jpn. J. Appl. Phys.

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Pb(Zr0.52,Ti0.48)O3 thin-films with various thicknesses were prepared on releasable Pt/SiO2/Si substrates. The adhesion force between Pt and SiO2 was estimated, mainly in the viewpoint of the diffusion of Pb, in X-ray photoelectron spectroscopy (XPS) and tensile test for the clarification of the bonding properties of the nano-transfer method. The adhesion strength of Pt to SiO2 has an inverse linear relationship with the thickness of Pt. On the other hand the adhesion strength of the samples, that were crystallized with different number of layers, were shown to be in the same region of 2–4 MPa as in case of PZT with over 250 nm in thickness. These results indicate that the origin of the bonding is the diffusion of Pb in the film and that the bonding strength is connected with the earlier stage of crystallization.

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Section: Xps Analysissupporting

confidence: 73%

Section: Introductionmentioning

confidence: 77%

Section: Tensile Testsmentioning

confidence: 98%

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Relationship between Diffusion and Adhesion Properties of Ferroelectric Thin-Film Structure on Releasable Substrate

Honda

Hosono

Fujino

et al. 2013

Jpn. J. Appl. Phys.

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“…Nevertheless, direct integration of PZT into the resin substrate of which melting point is about 300 °C is not available from the heat‐resistance aspect. Therefore, fundamental studies have been carried out on nanotransfer method, in which a material formed on a heat‐resistant substrate is peeled off and transferred to a resin substrate, and it was revealed that the effect of atomic diffusion on its adhesion to the base material . Furthermore, by taking advantage of the nanotransfer method as a processing technology, self‐assembled monolayer (SAM) transfer method, a dry peel‐off process , was introduced as a contaminant‐free transferring technique to a flexible polydimethylsiloxane (PDMS) resin substrate .…”

Section: Introductionmentioning

confidence: 99%

Transfer Methods of PZT Thin Capacitor to Flexible Polymer by Self‐Assembled Monolayers

Mizuno

Byun

Kim

et al. 2016

Elect Comm in Japan

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SUMMARY This paper describes the fabrication method that a lead zirconate titanate (PZT) thin film capacitor, which is formed on a Si substrate by metal organic decomposition (MOD), can be easily transferred to flexible polymer (polydimenthylsiloxane; PDMS) without additional chemical contamination. The thin film capacitor is composed of sandwich structure of PZT between two metal layers. To embed the capacitor structure in the polymer substrate by dry peel‐off process, three kinds of self‐assembled monolayers (SAMs) were investigated for adhesion or antiadhesion layer between metal, polymer, and Si substrate, respectively. Also, the MOD's annealing process with SAMs for PZT lamination was investigated. As a result, the PZT capacitors of 1 μm thickness with a perovskite structure were successfully transferred and embedded in PDMS substrate. These results will be useful for fabricating MEMS devices and integration technology of electrical device to a polymer substrate such as capacitors in three‐dimensional integration or for flexible electronics.

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Fabrication of PZT Thin Film on a Detachable Board and Its Adhesion Property

Cited by 2 publications

References 4 publications

Relationship between Diffusion and Adhesion Properties of Ferroelectric Thin-Film Structure on Releasable Substrate

Relationship between Diffusion and Adhesion Properties of Ferroelectric Thin-Film Structure on Releasable Substrate

Transfer Methods of PZT Thin Capacitor to Flexible Polymer by Self‐Assembled Monolayers

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