Fabrication of Si field emitter array in local vacuum package

Noda, Daiji; Hatakeyama, Masanori; Kyogoku, M.; Ikushima, Kimiya; Sawada, Kazuaki; Ishida, M.

doi:10.1116/1.1851533

Cited by 5 publications

(3 citation statements)

References 7 publications

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“…Much research was devoted to this field [8,16,18,19,[20][21][22][23][24][25][26][27][28] by using getter technology, and the appropriate getters applicable for MEMS devices need high temperature activation. This paper proposed a novel package design with a vacuum buffer cavity as shown in Fig.…”

Section: Novel Package Design Conceptmentioning

confidence: 99%

Getter free vacuum packaging for MEMS

Gan

Huang

Wang

et al. 2009

Sensors and Actuators A: Physical

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Section: Novel Package Design Conceptmentioning

confidence: 99%

Getter free vacuum packaging for MEMS

Gan

Huang

Wang

et al. 2009

Sensors and Actuators A: Physical

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“…For example, large field emitters with steerable beams have been developed for massively parallel direct-write lithography systems [2], vacuum micromachining, ultra-high speed switching elements [3] and nano-emissive and carbon nanotube displays. However, successful commercial applications have so far mostly been limited to niches, partly as a result of lifetime and reliability limitations of existing cold cathode [7].…”

Section: Previous Workmentioning

confidence: 99%

A freespace crossbar for multi-core processors

Victor¹,

Silzars

Davidson

2008

Proceedings of the 22nd Annual International Conference on Supercomputing

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A new package-level interconnect is described that adapts carbon nanoemissive display technology to create an inexpensive package-level freespace crossbar with single-cycle source-totarget latency. Interconnections are made using filamentary electron beams as the data transmission medium. The beams are electrostatically steered, enabling very large, low latency interchip crossbar networks. The crossbar and associated package are built entirely from existing technology. This paper describes the operation of the crossbar and presents a conceptual design for a processor that uses the crossbar.

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“…1. 4,5) To achieve this, we have fabricated a localized microvacuum package on a Si substrate that incorporates a FEA and a Ti getter. The local vacuum package technique was used to fabricate the Si emitter arrays with on-chip ICs.…”

Section: Introductionmentioning

confidence: 99%

Development of Cavity Structure for Field Emission on Si Substrate

Noda¹,

Hatakeyama

Nishijyou

et al. 2007

jjap

Self Cite

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A device used for superhigh-speed communications on the terahertz band is required. However, high-speed-response devices fabricated using Si-based technology cannot achieve this frequency. Field emitters have exhibited a high-speed response at frequencies higher than 100 GHz utilizing electron emission in a vacuum. Therefore, field emission devices are very suitable for use as high-speed switching elements. We have fabricated a local vacuum package enclosing a Si field emitter array and a Ti getter on a Si substrate using Si integrated circuit (IC) technology and micro-electro-mechanical system (MEMS) technology for an on-chip integrated device. In this paper, we discuss the Ti getter. The bridge structure getter was successfully evaporated within the cavity structure. This technique can realize micrometer-order alignment, and will be very useful for many applications owing to its high performance.

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Fabrication of Si field emitter array in local vacuum package

Cited by 5 publications

References 7 publications

Getter free vacuum packaging for MEMS

Getter free vacuum packaging for MEMS

A freespace crossbar for multi-core processors

Development of Cavity Structure for Field Emission on Si Substrate

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