Fabrication of Smallest Vias in LTCC Tape

Hagen, Gunter; Rebenklau, Lars

doi:10.1109/estc.2006.280072

Cited by 17 publications

(12 citation statements)

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“…There are four main groups of the LTCC machining methods: punching [40][41][42][43], laser cutting [44][45][46][47][48][49], milling [2,50] and embossing [51][52][53][54]. The most widely used are punching and laser cutting.…”

Section: Methods Of Tape Machiningmentioning

confidence: 99%

Overview on low temperature co-fired ceramic sensors

Jurków

Maeder

Dąbrowski

et al. 2015

Sensors and Actuators A: Physical

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Low Temperature Co-fired Ceramics (LTCC) is one of the microelectronic techniques. This technology was initially developed as an alternative to Printed Circuit Boards (PCB) and classical thick-film technology, and it has found application in the fabrication of multilayer ceramic boards for electronic devices. Fast and wide development of this technology permitted the fabrication of 3D mechanical structures and integration with various different processes. Thanks to this, LTCC has found application in the manufacturing of various microelectronic devices. This paper presents an overview on LTCC technology and gives a detailed summary on physical quantity sensors fabricated using LTCC technique.

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Section: Methods Of Tape Machiningmentioning

confidence: 99%

Overview on low temperature co-fired ceramic sensors

Jurków

Maeder

Dąbrowski

et al. 2015

Sensors and Actuators A: Physical

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“…These patterns are generally fabricated on unfired ceramic tapes (i.e., green tapes); then the tapes will be undergone other processing steps such like pattern printing, via filling, multi-layered lamination and co-firing (Golonka 2005). The embedded micro patterns are conventionally fabricated by mechanical punching or laser machining on green ceramic tapes or multi-layered green sheets, followed by lamination and cofiring (Wang et al 2006;Hagen and Rebenklau 2006). These conventional fabrication methods, however, have unavoidable limitations, for instance, the minimum features are limited by the size of the machining tools, and the minimum depth is restricted by the layer thickness of a green ceramic tape.…”

Section: Introductionmentioning

confidence: 99%

Study on micro hot embossing of low temperature co-firable ceramic green substrates

et al. 2008

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Multi-layered ceramic substrates with embedded micro patterns are becoming increasingly important, for example, in harsh environment electronics, enabling microsystems and microfluidic devices. Fabrication of these embedded micro patterns, such as micro channels, cavities and vias, is a challenge. This study focuses on the process aspects of patterning micro features on low temperature co-firable ceramic (LTCC) green substrates using micro hot embossing. Green ceramic tapes that possessed near-zero shrinkage in the x-y plane were used, six layers of which were stacked and laminated as a substrate. The process parameters that impact on the embossing fidelity were investigated and optimized in this study. Micro features with channel-width as small as several micrometers were formed on green ceramic substrates. The dynamic thermo-mechanical analysis indicated that extending the holding time at a certain temperature range would harden the substrates with little effect on improving the embossing fidelity. Ceramic substrates with embossed micro patterns were obtained after co-firing; the shrinkage ratios of the embossed depth and channel-width were 8-15 and 12-17%, respectively. The changes of pitches between two embossed channels were within ±1.0% due to the interlocking effect of the ceramic tapes.

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“…To meet various application-oriented needs, it is becoming increasingly important to develop alternative different processes for patterning unfired green ceramic tapes (Imanaka 2004). The conventional methods for fabricating micro vias and cavities on individual green ceramic tapes are mechanical punching (Wang et al 2006) or laser drilling (Hagen and Rebenklau 2006). However, these methods have limitations, for instance, the minimum depth of generated patterns is restricted by the thickness of a green ceramic tape; and the lateral dimensional of a minimum feature is limited by the sizes of punching needles or laser beams.…”

Section: Introductionmentioning

confidence: 99%

A micro roller embossing process for structuring large-area substrates of laminated ceramic green tapes

et al. 2008

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This paper presents a micro roller embossing process for patterning large-area substrates of laminated green ceramic tapes. The aim of this research is to develop a large-area microstructure formation technique for green ceramic substrates using a thermal roller laminator, which is compatible with screen printing apparatus. A thin film nickel mold was developed via photolithographic patterning and nickel electroplating on a 75-lm-thick nickel film. The mold had an effective panel size of 150 mm 9 150 mm with the height of plated protrusive patterns being about 38 lm. Formation of micro patterns was successfully demonstrated over the whole panel area on laminated green ceramic tapes using roller embossing. Micro patterns for inductors, heaters as well as interconnection with 50 lm line-width were embossed on green ceramic substrates. By means of tuning process parameters including roller temperature, applied pressure and feeding speed, we have demonstrated that micro roller embossing is a promising method for patterning large-area green ceramic substrates.

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Fabrication of Smallest Vias in LTCC Tape

Cited by 17 publications

References 0 publications

Overview on low temperature co-fired ceramic sensors

Overview on low temperature co-fired ceramic sensors

Study on micro hot embossing of low temperature co-firable ceramic green substrates

A micro roller embossing process for structuring large-area substrates of laminated ceramic green tapes

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