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AbstractPurpose -This paper aims to present systematic studies of a wide spectrum of geometrical and electrical properties of thick-film and LTCC microresistors (with designed dimensions between 50 £ 50 mm 2 and 800 £ 200 mm 2 ). Design/methodology/approach -The geometrical parameters (average length, width and thickness, relations between designed and real dimensions, distribution of planar dimensions) are correlated with basic electrical properties of resistors (sheet resistance and its distribution, hot temperature coefficient of resistance and its distribution distribution) as well as long term thermal stability and durability of microresistors to short electrical pulses. Findings -Fodel process gives better resolution than standard screen-printing and leads to smaller dimensions than designed, smaller absolute error and better uniformity of planar sizes. Microresistors made in full Fodel process show much weaker dimensional effect and exhibit noticeably smaller distribution of basic electrical properties. Originality/value -Presents systematic studies of a wide spectrum of geometrical and electrical properties of thick-film and LTCC microresistors.
The paper reports some results of a cooperation research in which the possibility to realize microfluidic components and modules by using low temperature cofiring ceramic multilayer (LTCC-ML) technology is examined. The main goal is the development of LTCC multilayer which are carrier for microfluidic Silicon components and combine electrical and fluidic fimctions. Also fluidic mixer elements and hybrid microvalves were developed. These different components are combined during the examinations to realize a microscope chamber. This is a fluidic microsystem to inspect and treatment smallest samples for life science applications. It can be used in high resolution microscopes. The microscope chamber consists of a LTCC manifold which contains fluidic channels and forms the carrier for assembled microfluidic and electric silicon components.
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