1995
DOI: 10.1117/12.206266
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Fabrication of submicron relief gratings in p-GaAs in the process of maskless holographic wet etching by laser-induced etch rate reduction method

Abstract: We report the masidess holographic fabrication of submicron relief diffraction gratings with periods 230-500 nm and depth-to-spacing ratio as high as 0.5 on the surface ofp-GaAs under visible laser light. The gratings were fabricated in the process of photochemical wet etching by laser-induced etch rate reduction method. The physical mechanism of laserinduced grating formation in p-type semiconductors is considered.

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“…The photo-assisted dissolution of semiconductors in aqueous solutions offers especially attractive possibilities in device fabrication (8)(9)(10); this is especially true for those without externally applied potential (i.e., electroless) since they are most compatible with the existing device technology. The photo-assisted dissolution has many possible applications such as control of the etched sidewall profile (1,7), maskless etching, selective etching and control of the etched side wall profile.…”
Section: Introductionmentioning
confidence: 99%
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“…The photo-assisted dissolution of semiconductors in aqueous solutions offers especially attractive possibilities in device fabrication (8)(9)(10); this is especially true for those without externally applied potential (i.e., electroless) since they are most compatible with the existing device technology. The photo-assisted dissolution has many possible applications such as control of the etched sidewall profile (1,7), maskless etching, selective etching and control of the etched side wall profile.…”
Section: Introductionmentioning
confidence: 99%
“…The literature suggests photo-dissolution models based on the Gerischer's band bending model [27, 31-35 (11, 15) for simple cases of bulk GaAs material (8) and GaAs/AlGaAs double layers (2) whereby photo-generated carriers control the dissolution. These models primarily focus on the dissolution rate and not on the surface condition and the sidewall angle variation for photo-assisted semiconductor dissolution.…”
Section: Introductionmentioning
confidence: 99%