Fabrication of Transparent Multilayer Circuits by Inkjet Printing

Jiang, Jieke; Bao, Bin; Li, Mingzhu; Sun, Jiazhen; Zhang, Cong; Li, Yang; Li, Fengyu; Yao, Xi; Song, Yanlin

doi:10.1002/adma.201503682

Cited by 183 publications

(152 citation statements)

References 48 publications

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“…As the semi-wrapped AgNPs were encapsulated by PDMS, the fabricated silver circuits could be used to resist bending without apparent resistance increase [55]. As a comparison, circuits inkjet printed on a PET surface using the Ag precursor ink were tested as the control sample.…”

Section: Resultsmentioning

confidence: 99%

Fabrication of Bendable Circuits on a Polydimethylsiloxane (PDMS) Surface by Inkjet Printing Semi-Wrapped Structures

et al. 2016

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In this work, an effective method was developed to fabricate bendable circuits on a polydimethylsiloxane (PDMS) surface by inkjet printing semi-wrapped structures. It is demonstrated that the precured PDMS liquid film could influence the depositing morphology of coalesced silver precursor inkjet droplets. Accordingly, continuous and uniform lines with a semi-wrapped structure were fabricated on the PDMS surface. When the printed silver precursor was reduced to Ag nanoparticles, the fabricated conductive film exhibited good transparency and high bendability. This work presented a facile way to fabricate flexible patterns on a PDMS surface without any complicated modification or special equipment. Meanwhile, an in situ hydrazine reduction of Ag has been reported using the vapor phase method in the fabricating process.

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Section: Resultsmentioning

confidence: 99%

Fabrication of Bendable Circuits on a Polydimethylsiloxane (PDMS) Surface by Inkjet Printing Semi-Wrapped Structures

et al. 2016

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“…However, if the electrode is transferred with an adhesive tape, the electrical resistance of the electrode increases. [8][9][10]21,22] Figure 5b provides the relative electrical resistivity modifications of four cases measured with a bending radius of 2.0 mm, with many bending cycles for each sample. However, the line resistance of the transferred electrode somewhat increased due to the fractured interparticle space being filled with 1D silver nanoparticles.…”

Section: Figurementioning

confidence: 99%

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confidence: 99%

“…[11][12][13]15,16,20] We propose a patterning mechanism that offers a closer nozzleto-substrate distance than conventional EHD printing operating at less than 100 µm to easily charge the electron moving nozzle with ground (GNR) in spite of using an insulated PET substrate (Figure 1a,b, inset). Examples of such include roll-to-stamp printing, [1,4] screen printing, [5] dropon-demand printing, [6][7][8] direct pen writing [9,10] and electrohydrodynamic (EHD) printing. This electrode resolution was controlled by increasing the printing speed ( Figure S1a,b, Supporting Information).…”

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Fabrication of a Quasicrystal Electrode at a Low Processing Temperature via Electrohydrodynamic and Transfer Printing for use in Multifunctional Electronics

Park

et al. 2017

Adv Elect Materials

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temperature or with heating at less than 60 °C for 1 h. This is not only one of the important conditions for determining the degree of aggregation of silver, but also for controlling the binding energy of silver or the density of silver that would be higher at the bottom. [18,19] We can also transfer print from the receiver to the adhesive tape, which results in a quasicrystal morphology (R a = nanoscale) with truly excellent flexibility and durability. [8][9][10]21,22] With this approach, we can fabricate flexible tiled circuits, water-proof light emitting diodes (LEDs) without any additional restricting condition, and this transferred electrode would be freestanding, attached to various uneven interface operated LEDs. A merit of this method is that, without adaptive printing on the 3D circuits, we can apply the electrodes on 3D structures by using the projected electrodes.Furthermore, these electrodes are connected to each other to produce long-ranged line pattern arrays, and the soldering disconnection of a wire can be achieved with the nonpatterned residue of the adhesive region.Based on this study, e-NDP can be considered as a new method, which is different from the existing EHD method that needs the condition of a nozzle-to-substrate distance of less than 500 µm for the near-field electrospinning jet. In the existing EHD method, only the Si wafer and the glass substrate through which charged electrons can be transferred to the ground and only their parts in which the solution is aligned after taylorcone formation at the nozzle tip have been used. [11][12][13]15,16,20] We propose a patterning mechanism that offers a closer nozzleto-substrate distance than conventional EHD printing operating at less than 100 µm to easily charge the electron moving nozzle with ground (GNR) in spite of using an insulated PET substrate (Figure 1a,b, inset). This method can be used to fabricate a silver micropatterned electrode that can be printed in ≈4 s (20 mm s −1 is the optimized speed for formation of the electrode) with a 70 mm parallel line pattern. This electrode resolution was controlled by increasing the printing speed ( Figure S1a,b, Supporting Information). Figure 1 shows a schematic to fabricate a silver micropatterned electrode using the e-NDP process. The first step is to pattern a silver trace after printing the e-NDP solution on a PET substrate coated with silver trifluoroacetate (STA) (18 wt%) dissolved in volatile tetrahydrofuran (THF). The second step is to reduce the silver trace pattern using a hydrazine monohydrate solution with ethyl alcohol (30 wt%). This solution is overpatterned on the position of the silver trace at a low temperature of 60 °C for 1 h. As the experimental equipment has a function of automatically performing overpatterning, misalignment could not occur during same-trace-position printing.Pattern formation is a complex technology that has resulted from a collaborative effort by researchers in chemistry and industrial processing. Bath processing has been implemented by a myriad of organiza...

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“…This makes the method cost-effective, highly efficient in terms of material usage, scalable and simple in terms of processing, and flexible for use on various types of substrates123. Many examples have been reported for using metallic inks in printed electronics, such as light-emitting diodes (LEDs)4, circuits5, flexible displays6, and radio frequency identification (RFID) tags7. Conductive inks or pastes based on silver are currently preferred because of their lowest resistivity (1.6 × 10 −8 Ω·m) and stability in air8.…”

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Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions

Yong

Nguyen

Tsukamoto

et al. 2017

Sci Rep

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Mixtures of a copper complex and copper fine particles as copper-based metal-organic decomposition (MOD) dispersions have been demonstrated to be effective for low-temperature sintering of conductive copper film. However, the copper particle size effect on decomposition process of the dispersion during heating and the effect of organic residues on the resistivity have not been studied. In this study, the decomposition process of dispersions containing mixtures of a copper complex and copper particles with various sizes was studied. The effect of organic residues on the resistivity was also studied using thermogravimetric analysis. In addition, the choice of copper salts in the copper complex was also discussed. In this work, a low-resistivity sintered copper film (7 × 10−6 Ω·m) at a temperature as low as 100 °C was achieved without using any reductive gas.

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Fabrication of Transparent Multilayer Circuits by Inkjet Printing

Cited by 183 publications

References 48 publications

Fabrication of Bendable Circuits on a Polydimethylsiloxane (PDMS) Surface by Inkjet Printing Semi-Wrapped Structures

Fabrication of Bendable Circuits on a Polydimethylsiloxane (PDMS) Surface by Inkjet Printing Semi-Wrapped Structures

Fabrication of a Quasicrystal Electrode at a Low Processing Temperature via Electrohydrodynamic and Transfer Printing for use in Multifunctional Electronics

Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions

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