2006
DOI: 10.1109/jstqe.2005.862947
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Fabrication-tolerant active-passive integration scheme for vertically coupled microring resonator

Abstract: Abstract-The large-scale photonic integration of microring resonators in three dimensions made possible by recent developments in vertical coupling and wafer bonding technology is shown to be sensitive to lateral mask misalignment for the ring and bus waveguides introduced during the fabrication process. For a typical 20-µm radius, vertically coupled microring calculations reveal a linear relationship between deviation in the coupling coefficient and lateral misalignment. A coupling coefficient reduction of 50… Show more

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Cited by 24 publications
(1 citation statement)
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“…Since the resonator in/out coupling is commonly done in the form of an evanescent coupling scheme, it is easier to meet the latter condition with the technological approach which offers the most tolerant and controllable process. It turns out to be when the resonator lies above the access waveguide or, in other words, when the device is made by vertical integration 4,5 . To implement such geometry in practice, the fabrication of a buried (access) waveguide with a planar top surface is needed.…”
Section: Introductionmentioning
confidence: 99%
“…Since the resonator in/out coupling is commonly done in the form of an evanescent coupling scheme, it is easier to meet the latter condition with the technological approach which offers the most tolerant and controllable process. It turns out to be when the resonator lies above the access waveguide or, in other words, when the device is made by vertical integration 4,5 . To implement such geometry in practice, the fabrication of a buried (access) waveguide with a planar top surface is needed.…”
Section: Introductionmentioning
confidence: 99%