Fabrication uncertainties and yield optimization in MEMS tunable capacitors

Shavezipur, Mohammad; Ponnambalam, K.; Khajepour, Amir; Hashemi, Seyed Mohammad

doi:10.1016/j.sna.2008.03.025

Cited by 24 publications

(12 citation statements)

References 21 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Discrepancies between initial designs and products deteriorate quickly with the feature size reductions. Even with the state-of-art fabrication techniques, process variations occur inevitably [ 1 , 2 , 3 ]. The process variations mainly include misalignment, footing as well as critical dimension (CD) loss [ 4 ], manifested as inclination, over-etching and undulating sidewalls in the Bosch process [ 5 ].…”

Section: Introductionmentioning

confidence: 99%

“…In addition, magnetometers adopted multiphysics-based optimization and nonlinear situations [ 14 ], and gyroscopes focused on the packaging with double yield [ 15 ]. Except for unique device analysis, methods that are generally applicable have advanced the processing improvement further [ 3 , 16 , 17 , 18 , 19 , 20 , 21 , 22 , 23 , 24 , 25 , 26 ]. Mirzazaden et al [ 16 , 17 , 18 ] investigated morphology uncertainties with reduced-order models through on-chip tests.…”

Section: Introductionmentioning

confidence: 99%

“…Mirzazaden et al [ 16 , 17 , 18 ] investigated morphology uncertainties with reduced-order models through on-chip tests. Moreover, Shavezipur et al [ 3 , 19 ], and Allen et al [ 20 ] proposed the first-order second-moment (FOSM) and advanced FOSM reliability method, respectively, in a probabilistic way to obtain a linearized feasible region and maximize the yield. For those non-linear actuated MEMS devices, high fidelity optimization schemes have also been realized.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Modeling of the Effect of Process Variations on a Micromachined Doubly-Clamped Beam

Gao¹,

Zhou²,

Huang³

2017

Micromachines

View full text Add to dashboard Cite

In the fabrication of micro-electro-mechanical systems (MEMS) devices, manufacturing process variations are usually involved. For these devices sensitive to process variations such as doubly-clamped beams, mismatches between designs and final products will exist. As a result, it underlies yield problems and will be determined by design parameter ranges and distribution functions. Topographical changes constitute process variations, such as inclination, over-etching, and undulating sidewalls in the Bosch process. In this paper, analytical models are first developed for MEMS doubly-clamped beams, concerning the mentioned geometrical variations. Then, finite-element (FE) analysis is performed to provide a guidance for model verifications. It is found that results predicted by the models agree with those of FE analysis. Assigning process variations, predictions for performance as well as yield can be made directly from the analytical models, by means of probabilistic analysis. In this paper, the footing effect is found to have a more profound effect on the resonant frequency of doubly-clamped beams during the Bosch process. As the confining process has a variation of 10.0%, the yield will have a reduction of 77.3% consequently. Under these circumstances, the prediction approaches can be utilized to guide the further MEMS device designs.

show abstract

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Modeling of the Effect of Process Variations on a Micromachined Doubly-Clamped Beam

Gao¹,

Zhou²,

Huang³

2017

Micromachines

View full text Add to dashboard Cite

show abstract

“…On the other hand, electrothermal actuation, among conventional techniques for electrical induction of mechanical vibrations, offers advantages such as simple fabrication process, low actuation voltages, impedance matching and effective resonant frequency tuning [6][7][8][9][10][11]. The ability to tune resonant frequency actively is of paramount importance for maintaining performance of MEMS resonators, as MEMS fabrication process uncertainties (dimensional and material property variations, and residual stresses) and changeable environmental conditions can cause shift in the resonant frequency [12].…”

Section: Introductionmentioning

confidence: 99%

Tunable MEMS cantilever resonators electrothermally actuated and piezoelectrically sensed

Sviličić

Mastropaolo

Zhang

et al. 2015

Microelectronic Engineering

View full text Add to dashboard Cite

a b s t r a c tThis paper reports on microelectromechanical (MEMS) cantilever resonant devices that are actuated electrothermally and sensed piezoelectrically, and have voltage tunable resonant frequencies. The devices have been designed as a two-port vertical-mode cantilever resonator. The single-clamped beam (cantilever) resonators have been fabricated in silicon carbide with top platinum electrothermal actuator (input port) and lead zirconium titanate piezoelectric sensor (output port). The performance of the devices has been demonstrated with two-port measurements of the transmission frequency response in atmospheric conditions. The measurements have shown that the devices with a beam length of 200 and 250 lm resonate in the frequency range 373-523 kHz with Q factor in air up to 455. By applying DC bias voltage between 6 and 11 V, a frequency tuning range of about 1300 ppm has been achieved, with the tuning range being wider for the shorter cantilever. Simulated results for different cantilever lengths show that higher temperature and stress are induced in the shorter cantilever, indicating that the resonant frequency change observed as a function of tuning DC voltage is dominated by the stress effect rather than geometric effect.

show abstract

“…Alternatively, the sensor can be directly integrated on the antenna of an RF front-end in order to modulate a critical characteristic such as frequency or radiation pattern (Figure lc) [2]- [5]. While work on the fabrication uncertainty of similar devices has been started [4], the uncertainty of the temperature has not been experimentally determined. Figure 1: (a) SEM image of sensor (after [1]) and examples of (b) integration with an appropriate sensor interface, and (c) direct integration on an antenna.…”

Section: Introductionmentioning

confidence: 99%

Experimental quantification of temperature uncertainty for an array of thermally-sensitive MEMS cantilever beams

Scott

Peroulis

2009

2009 IEEE Antennas and Propagation Society International Symposium

View full text Add to dashboard Cite

Presented in this paper is the experimental quantification of the temperature uncertainty in a MEMS thermally-tunable capacitor that is especially suited for harshenvironment applications. The measured temperature uncertainty is less than 0.64°C at each point tested, and less than 3.10% for the entire operating range. This recorded resolution is limited by the capacitance resolution of the employed IC circuit and the stray capacitances of the measurement setup.

show abstract

Fabrication uncertainties and yield optimization in MEMS tunable capacitors

Cited by 24 publications

References 21 publications

Modeling of the Effect of Process Variations on a Micromachined Doubly-Clamped Beam

Modeling of the Effect of Process Variations on a Micromachined Doubly-Clamped Beam

Tunable MEMS cantilever resonators electrothermally actuated and piezoelectrically sensed

Experimental quantification of temperature uncertainty for an array of thermally-sensitive MEMS cantilever beams

Contact Info

Product

Resources

About