Facile fabrication of spherical silicone encapsulant with Pt nanoparticles for applications as white light-emitting diode

Huang, Kuan-Chieh; Huang, Yi-Ru; Ting, Shao-Ying; Tseng, Chun-Ming; Tseng, Snow H.; Huang, Jing-En

doi:10.1016/j.matlet.2014.07.095

Cited by 5 publications

(4 citation statements)

References 14 publications

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“…Huang et al [88] added Pt nanoparticles (PtNPs) into the phosphor silicone composite and realized a spherical phosphor encapsulant for white LED packaging, and Fig. 21 shows two different phosphor morphologies with/without PtNPs.…”

Section: Fluid Morphology Controlmentioning

confidence: 99%

Heat and fluid flow in high-power LED packaging and applications

Luo

Qiu

Liu

et al. 2016

Progress in Energy and Combustion Science

412

121

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Light-emitting diodes (LEDs) are widely used in our daily lives. Both light and heat are generated from LED chips and then transmitted or conducted through multiple packaging materials and interfaces. Part of the transmitted light converts into heat along the light propagation; in return, the accumulation of heat leads to the degradation of light output. The accumulated heat negatively influences the reliability and longevity of LEDs, and thus thermal management is critical for LED packaging and applications. On the other hand, in LED packaging processes, many fluid flow problems exist, such as phosphor coating, silicone injection, chip bonding, solder reflow, etc. Amongst them, phosphor coating is the most important process which is essential for LED performance. Phosphor gel is a kind of non-Newton fluid and its coating process is a typical fluid-flow problem. Overall, since LED packaging and applications present many heat and fluid flow problems, obtaining a full understanding of these problems enables advancements in the development of LED processes and designs. In this review, the emphasis is placed on heat generation in chips, heat flow in packages and application products, fluid flow in phosphor coating process, etc. This is a domain in which significant progress has been achieved in the last decade, and reporting on these advances will facilitate state-of-the-art LED packaging and application technologies.

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Section: Fluid Morphology Controlmentioning

confidence: 99%

Heat and fluid flow in high-power LED packaging and applications

Luo

Qiu

Liu

et al. 2016

Progress in Energy and Combustion Science

412

121

View full text Add to dashboard Cite

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“…对于单芯片LED模块. Lee等人 [127] 对荧光粉颗粒表面进行等离子处理, 用处理后的荧光粉颗粒配置而成的荧光粉胶在基板上能实现大于150°的接触角; Jang等人 [128] 通过在硅基板上涂覆一层疏水涂层改变基板的表面特性, 当荧光粉胶的胶体为甘油时, 其在基板上能实现140.5°的接触角; Huang等人 [129] 通过在荧光粉胶中添加纳米Pt颗粒催化硅胶的固化从而获得如图26(a)所示的球状荧光粉层形貌, 实验验证相比于图26(b)所示的自然铺展下的荧光粉胶形貌, 该形貌将效率提高了20.6%. 对于阵列LED模块.…”

Section: 理论上光子晶体可以将芯片的出光效率提高到90%以unclassified

LED packaging for high light quality: Status and perspectives

Yu¹,

Shu²,

Hu³

et al. 2017

Sci. Sin.-Tech.

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“…[5,6] Addition-cure silicone encapsulant (ASE) has the merits of high thermal stability, excellent transparency, good chemical resistance, and adjustable hardness. [7][8][9] Especially, ASE with high refractive index can improve the light extraction efficiency, which is regarded as one of the most important high-performance packaging materials for LED devices. Unfortunately,…”

Section: Introductionmentioning

confidence: 99%

Synthesis of phenyl silicone resin with epoxy and acrylate group and its adhesion enhancement for addition-cure silicone encapsulant with high refractive index

Pan

Zeng

et al. 2016

Journal of Adhesion Science and Technology

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2016): Synthesis of phenyl silicone resin with epoxy and acrylate group and its adhesion enhancement for addition-cure silicone encapsulant with high refractive index, Journal of Adhesion Science and Technology To link to this article: http://dx.a college of Materials science and engineering, south china university of Technology, guangzhou, People's republic of china; b guangdong sheensun Technology co., ltd., foshan, People's republic of china ABSTRACTA novel phenyl silicone resin with epoxy and acrylate group (PSREA) was successfully synthesized via the non-hydrolytic sol-gel condensation reaction of 3-glycidoxypropyltrimethoxysilane, 3-methacryloyloxypropylmethyldimethoxysilane, and diphenylsilanediol, and was employed as the adhesion promoter for additioncure silicone encapsulant (ASE) with high refractive index. The structure of PSREA was confirmed by Fourier transform infrared spectroscopy, 1 H nuclear magnetic resonance spectroscopy, and 29 Si nuclear magnetic resonance spectroscopy. The influence of PSREA on the properties of ASE was studied. It was found that PSREA could markedly enhance the adhesion strength of ASE to aluminum (Al) and poly(p-phenylene terephthamide) (PPA) substrate. When the content of PSREA was 1.5 phr, the shear strength of ASE was 4.43 and 2.27 MPa for Al and PPA substrate, which was about 71 and 266% higher than that of ASE without the adhesion promoter, respectively. In addition, PSREA had little effect on the mechanical properties, refractive index, and viscosity of ASE.

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Facile fabrication of spherical silicone encapsulant with Pt nanoparticles for applications as white light-emitting diode

Cited by 5 publications

References 14 publications

Heat and fluid flow in high-power LED packaging and applications

Heat and fluid flow in high-power LED packaging and applications

LED packaging for high light quality: Status and perspectives

Synthesis of phenyl silicone resin with epoxy and acrylate group and its adhesion enhancement for addition-cure silicone encapsulant with high refractive index

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