Synthesis of phenyl silicone resin with epoxy and acrylate group and its adhesion enhancement for addition-cure silicone encapsulant with high refractive index

Pan, Kexue; Zeng, Xingrong; Li, Hongqiang; Chen, Zhonghua; Liang, Guangqiang

doi:10.1080/01694243.2016.1197091

Cited by 11 publications

(4 citation statements)

References 31 publications

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“…The relationships discussed above can also be clearly observed when analysing the properties of highly branched MQ silicone resins consisting of a monofunctional siloxane (R3SiO1/2, the M units) and a tetrafunctional siloxane (SiO4/2, the Q units) [13,14]. These polymers have favourable thermal stability due to the formation of new regular macromolecular structures and the introduction of phenyl groups [15]. These inorganic/organic hybrid materials can be used as a potential component of temperature-resistant electronics adhesives, heat-resistant coatings, and liquid silicone rubber.…”

Section: Enhancement Of Thermal Stability By Modification Of Siloxane...mentioning

confidence: 80%

Silicone Nanocomposites with Enhanced Thermal Resistance: A Review

Zielecka,

Rabajczyk

2024

Preprint

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Continuous technological progress places significant demands on the materials used in increasingly modern devices. An important parameter is often the long-term thermal resistance of the material. The use of heat-resistant polymer materials worked well in technologically advanced products. An economically justified direction in searching for new materials is the area of polymer nanocomposite materials. It is necessary to appropriately select both the polymer matrix and the nanofillers best able to demonstrate the synergistic effect. A promising area of exploration for such nanocomposites is the use of organosilicon polymers, which results from the unique properties of these polymers related to their structure. This review presents the results of the analysis of the most important literature reports regarding organosilicon polymer nanocomposites with increased thermal resistance. Particular attention was paid to modification methods of silicone nanocomposites focused on the increase of their thermal resistance related to the modification of siloxane molecular structure and by making nanocomposites using inorganic additives, carbon nanomaterials. Attention was also paid to such important issues as the influence of the dispersion of additives in the polymer matrix on the thermal resistance of silicone nanocomposites and the possibility of modifying the polymer matrix and permanently introducing nanofillers thanks to the presence of various reactive groups. The thermal stability mechanism of these nanocomposites was also analysed.

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Section: Enhancement Of Thermal Stability By Modification Of Siloxane...mentioning

confidence: 80%

Silicone Nanocomposites with Enhanced Thermal Resistance: A Review

Zielecka,

Rabajczyk

2024

Preprint

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“…The above-mentioned methods can effectively improve the adhesion of LSR to various substrates; however, both methods are time-consuming and complicated processes, and they are harmful to the environment. Therefore, the addition of adhesion promoters into LSR to provide a self-adhesive capacity has spurred intensive research interest due to the simple and scalable process and eco-friendly properties [ 29 , 30 , 31 , 32 , 33 ]. Pan et al reported a vinyl and epoxy groups-functionalized silane oligomer and used it as an adhesion promoter to prepare a self-adhesive addition-cure silicone encapsulant [ 32 ].…”

Section: Introductionmentioning

confidence: 99%

“…These reactive groups (i.e., epoxy, alkoxy and methacryloxy groups)-containing adhesion promoters generally demonstrated their great improvement in bonding performance at high working temperatures (>120 °C). However, most of the adhesion promoters are unable to offer an efficient adhesion ability for LSR at moderate curing temperatures (e.g., 80 °C) [ 31 , 32 , 33 ]. Therefore, it remains a challenge to achieve efficient encapsulation and provide long-term reliable protection for temperature-sensitive electronic devices.…”

Section: Introductionmentioning

confidence: 99%

Binary Promoter Improving the Moderate-Temperature Adhesion of Addition-Cured Liquid Silicone Rubber for Thermally Conductive Potting

Zheng

Wang²,

Nie³

et al. 2022

Materials

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The strong adhesion of thermally conductive silicone encapsulants on highly integrated electronic devices can avoid external damages and lead to an improved long-term reliability, which is critical for their commercial application. However, due to their low surface energy and chemical reactivity, the self-adhesive ability of silicone encapsulants to substrates need to be explored further. Here, we developed epoxy and alkoxy groups-bifunctionalized tetramethylcyclotetrasiloxane (D4H-MSEP) and boron-modified polydimethylsiloxane (PDMS-B), which were synthesized and utilized as synergistic adhesion promoters to provide two-component addition-cured liquid silicone rubber (LSR) with a good self-adhesion ability for applications in electronic packaging at moderate temperatures. The chemical structures of D4H-MSEP and PDMS-B were characterized by Fourier transform infrared spectroscopy. The mass percentage of PDMS-B to D4H-MSEP, the adhesion promoters content and the curing temperature on the adhesion strength of LSR towards substrates were systematically investigated. In detail, the LSR with 2.0 wt% D4H-MSEP and 0.6 wt% PDMS-B exhibited a lap-shear strength of 1.12 MPa towards Al plates when curing at 80 °C, and the cohesive failure was also observed. The LSR presented a thermal conductivity of 1.59 W m−1 K−1 and good fluidity, which provided a sufficient heat dissipation ability and fluidity for potting applications with 85.7 wt% loading of spherical α-Al2O3. Importantly, 85 °C and 85% relative humidity durability testing demonstrated LSR with a good encapsulation capacity in long-term processes. This strategy endows LSR with a good self-adhesive ability at moderate temperatures, making it a promising material requiring long-term reliability in the encapsulation of temperature-sensitive electronic devices.

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“…The introduction of phenyl can improve the heat resistance and refractive index of MQ silicone resin, which further enlarges its application possibilities [19]. To address the abovementioned issues, an approach to synthesize high molecular weight phenyl-modified MQ silicone resin (VPMQ) through the hydrosilylation reaction of low molecular weight vinyl-containing MQ silicone resin (VMQ) and linear poly(diphenylsiloxane) with two terminal Si-H bonds (PDPS) was reported.…”

Section: Introductionmentioning

confidence: 99%

Synthesis of High Molecular Weight Vinylphenyl-Con Taining MQ Silicone Resin via Hydrosilylation Reaction

Liang

et al. 2019

Coatings

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To overcome the inherent limitation that the preparation of high molecular weight MQ copolymers (Mw ≥ 30,000 g/mol) via the hydrolysis and condensation of solicate salts generally results in an intractable gel, vinylphenyl-containing MQ silicone resin with a high molecular weight was designed and synthesized through the hydrosilylation reaction of vinyl-containing MQ silicone resin and linear poly(diphenylsiloxane) with two terminal Si–H bonds. The weight average molecular weight of these modified copolymers reported here is at least 30,000 dal·mol−1. These polymers have favorable thermal stability and a higher refractive index than that of the base resin due to the formation of novel regular macromolecular structures and the introduction of phenyl groups. These inorganic/organic hybrid materials could be used as a potential component for temperature-resistance electronics adhesive, heat-resistant coatings and high-performance liquid silicone rubber. Moreover, the proposed process also provides a possibility to choose higher molecular weight MQ silicones according to application requirements.

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Synthesis of phenyl silicone resin with epoxy and acrylate group and its adhesion enhancement for addition-cure silicone encapsulant with high refractive index

Cited by 11 publications

References 31 publications

Silicone Nanocomposites with Enhanced Thermal Resistance: A Review

Silicone Nanocomposites with Enhanced Thermal Resistance: A Review

Binary Promoter Improving the Moderate-Temperature Adhesion of Addition-Cured Liquid Silicone Rubber for Thermally Conductive Potting

Synthesis of High Molecular Weight Vinylphenyl-Con Taining MQ Silicone Resin via Hydrosilylation Reaction

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