2012
DOI: 10.1063/1.4726085
|View full text |Cite
|
Sign up to set email alerts
|

Facile large-area photolithography of periodic sub-micron structures using a self-formed polymer mask

Abstract: This letter reports the methodology of a low-cost fabrication technique for producing periodic sub-micron structures over a large area, using a polymer mask. A thin film of gold/palladium or silica is deposited on a stretched polydimethylsiloxane (PDMS) substrate. Release of the tension forms a buckling sinusoidal pattern on the surface. The PDMS substrates are then used as masks in soft contact optical lithography, bypassing the need for an expensive lithographic process toward creating regular patterns on a … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
5

Citation Types

1
8
0

Year Published

2014
2014
2020
2020

Publication Types

Select...
5
1

Relationship

0
6

Authors

Journals

citations
Cited by 8 publications
(9 citation statements)
references
References 32 publications
1
8
0
Order By: Relevance
“…Unfortunately, fabricating a desired surface structure on glass substrates used in dye-sensitized solar cells (DSCs), organic solar cells (OSCs), and perovskite solar cells is far from straightforward. Furthermore, the surface structuring of crystalline silicon (c-Si) solar cells not only requires complex processes but also increases the surface area of the cell, which leads to a decrease in efficiency of the device owing to surface recombination. …”
Section: Introductionmentioning
confidence: 99%
“…Unfortunately, fabricating a desired surface structure on glass substrates used in dye-sensitized solar cells (DSCs), organic solar cells (OSCs), and perovskite solar cells is far from straightforward. Furthermore, the surface structuring of crystalline silicon (c-Si) solar cells not only requires complex processes but also increases the surface area of the cell, which leads to a decrease in efficiency of the device owing to surface recombination. …”
Section: Introductionmentioning
confidence: 99%
“…Top‐down techniques are usually lithographic, for example, photolithography, e‐beam lithography, and nanoimprint lithography, which have a high level of precision and reproducibility. However, these processes involve expensive equipment that increase both fabrication time and cost.…”
Section: Introductionmentioning
confidence: 99%
“…Electron beam lithography (EBL), deep ultraviolet lithography, interference lithography, scanning probe microscope (SPM) lithography, and nanoimprint lithography (NIL) are well-known techniques to fabricate nanometer and submicron feature structures [1115], but expensive equipment is required for EBL, deep ultraviolet lithography, and interference lithography and the serial write mechanism of SPM lithography and EBL makes large-area patterning costly and time-consuming [16]. Although nanoimprint lithography is relatively low cost compared to those mentioned above, the initial submicron patterning technique required to fabricate a master mold or masking pattern is still an essential process [16].…”
Section: Introductionmentioning
confidence: 99%
“…Although nanoimprint lithography is relatively low cost compared to those mentioned above, the initial submicron patterning technique required to fabricate a master mold or masking pattern is still an essential process [16]. Recently, the laser direct writing (LDW) technique has been proven to be a very effective and low-cost method to fabricate large-area periodic submicron structures, which demands neither a vacuum environment nor a particular light source offering a large freedom of choice of photoresists.…”
Section: Introductionmentioning
confidence: 99%