2012
DOI: 10.1016/j.orgel.2012.01.007
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Facile synthetic route to implement a fully bendable organic metal–insulator–semiconductor device on polyimide sheet

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Cited by 7 publications
(1 citation statement)
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“…In general, there are two approaches for achieving higher dielectric constant for polyimide materials. One is to fill high- k ceramic fillers, such as TiO 2 , 15 Al 2 O 3 , 16 BaTiO 3 ( ref. 17–20 ) and CaCu 3 Ti 4 O 12 , 21–23 into the polyimide matrix.…”
Section: Introductionmentioning
confidence: 99%
“…In general, there are two approaches for achieving higher dielectric constant for polyimide materials. One is to fill high- k ceramic fillers, such as TiO 2 , 15 Al 2 O 3 , 16 BaTiO 3 ( ref. 17–20 ) and CaCu 3 Ti 4 O 12 , 21–23 into the polyimide matrix.…”
Section: Introductionmentioning
confidence: 99%