2021
DOI: 10.1016/j.apenergy.2021.116917
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Facile technique to encapsulate phase change material in an amphiphilic polymeric matrix for thermal energy storage

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Cited by 37 publications
(15 citation statements)
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“…Therefore, modulated DSC (MDSC) was performed for PSSP 550 and PSSP 750 as shown in Figure (c),(d), respectively. Reversible heat flow traces (red lines) showed the presence of two endothermic peaks corresponding to PSSP 550 and PSSP 750 . , This is most likely due to the rearrangement of hydrophilic and hydrophobic domain of the resins and glass transition occurring due to the segmental motion of polymer chains. ,, …”
Section: Resultsmentioning
confidence: 97%
See 1 more Smart Citation
“…Therefore, modulated DSC (MDSC) was performed for PSSP 550 and PSSP 750 as shown in Figure (c),(d), respectively. Reversible heat flow traces (red lines) showed the presence of two endothermic peaks corresponding to PSSP 550 and PSSP 750 . , This is most likely due to the rearrangement of hydrophilic and hydrophobic domain of the resins and glass transition occurring due to the segmental motion of polymer chains. ,, …”
Section: Resultsmentioning
confidence: 97%
“…44,45 This is most likely due to the rearrangement of hydrophilic and hydrophobic domain of the resins and glass transition occurring due to the segmental motion of polymer chains. 44,46,47 Self-Assembly of Nanoparticles. As we observed that the PSSPs showed concentration-dependent surface tension reduction of water, we hypothesized that the molecules most likely form self-assembled structures in aqueous environments.…”
Section: ■ Materials and Methodsmentioning
confidence: 99%
“…Moreover, polymeric supporting materials can encapsulate PCMs in core-shell-like capsules, addressing the leakage of PCMs. 26,27 However, the preparation process of polymeric shells is relatively complex, poisonous, and unfriendly to the environment.…”
Section: Introductionmentioning
confidence: 99%
“…16 The utilization of microencapsulation technology to package PCMs in the shell is considered to be a promising way for effectively solving the leakage of solid−liquid PCMs. 17,18 The organic polymers such as urea-formaldehyde (UF) resin, 19 melamineformaldehyde (MF) resin, 20,21 and polystyrene (PS) 22,23 as shell materials to encapsulate PCMs have been widely studied.…”
Section: Introductionmentioning
confidence: 99%
“…However, the easy leakage of the melting process from solid to liquid greatly limits their practical application . The utilization of microencapsulation technology to package PCMs in the shell is considered to be a promising way for effectively solving the leakage of solid–liquid PCMs. , The organic polymers such as urea-formaldehyde (UF) resin, melamine-formaldehyde (MF) resin, , and polystyrene (PS) , as shell materials to encapsulate PCMs have been widely studied. Although organic polymers as shell materials have excellent flexibility, they also have some shortcomings such as poor chemical resistance, low thermal conductivity, and flammability.…”
Section: Introductionmentioning
confidence: 99%