Failure analysis of die crack in lidless packages

Foo, Fang Jie; Ong, Maliki; Tay, M. Y.

doi:10.1109/ipfa.2010.5532238

Cited by 3 publications

(1 citation statement)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The active zone is a complex structure of epitaxial layers. For different colours, different material combinations are used: InAlGaP -red, InGaN -blue, GaAlAs -IR, AlGaN -UV [4][5][6]. During normal operation, optical performance of IREDs gradually decreases with lifetime.…”

Section: Introductionmentioning

confidence: 99%

Effect of damaged-chip infrared emitter package on Ge substrate

Liew

Devarajan

2012

2012 10th IEEE International Conference on Semiconductor Electronics (ICSE)

View full text Add to dashboard Cite

Die cracking is the occurrence of fracture(s) in or on any part of the die of a semiconductor device. Failure caused by die cracking is one of the major concerns in packaging design and reliability. In this paper, fracture is inflicted onto the chip of a few units of p-Ge infrared emitting diode (IRED) package. Failure analysis such as curve tracing, decapsulation and visual inspection as well as SEM and EDX was performed on the units to characterize the fracture pattern and size. The results show dependence of the current-voltage (I-V) characteristic on the severity of the fracture inflicted onto the chip.

show abstract

Section: Introductionmentioning

confidence: 99%

Effect of damaged-chip infrared emitter package on Ge substrate

Liew

Devarajan

2012

2012 10th IEEE International Conference on Semiconductor Electronics (ICSE)

View full text Add to dashboard Cite

show abstract

Fundamental study of fracture strength of silicon dies in flip-chip lidless packages

Sathanantham

Foo

2012

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)

View full text Add to dashboard Cite

Quality Monitors and Inspection Criteria for Bare Die Flip Chip Ball Grid Array and Bare Die PoP Packages.

Vanam

Newman

Poustinchi

et al. 2014

International Symposium on Microelectronics

View full text Add to dashboard Cite

Package form factor and cost are one of the key drivers in smart phone and tablet landscape. In order to meet these requirements hand held market has seen emergence of bare die flip chip ball grid array (BD FCBGA) and bare die package on package (BD PoP). As the name implies, these packages don't have a mold cap or heat spreader surrounding the silicon die resulting in lower cost and smaller form factor. Further package thickness reduction is possible by thinning of silicon die without significantly affecting high temperature (HT) warpage or coplanarity. One of the main concerns with aforementioned bare die package (BDP) configurations is die crack failure during assembly, testing, shipping or surface mount operation (SMT). The propensity of die crack failures further increases as thinner die is employed to meet overall package height requirements. This work focusses on evaluating various inspection tools for detecting gross die cracks to fine line cracks up to ~ 0.7 μm wide. Some of the key considerations for inspection tools, at assembly and test operations will be presented.

show abstract

Failure analysis of die crack in lidless packages

Cited by 3 publications

References 0 publications

Effect of damaged-chip infrared emitter package on Ge substrate

Effect of damaged-chip infrared emitter package on Ge substrate

Fundamental study of fracture strength of silicon dies in flip-chip lidless packages

Quality Monitors and Inspection Criteria for Bare Die Flip Chip Ball Grid Array and Bare Die PoP Packages.

Contact Info

Product

Resources

About