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Package form factor and cost are one of the key drivers in smart phone and tablet landscape. In order to meet these requirements hand held market has seen emergence of bare die flip chip ball grid array (BD FCBGA) and bare die package on package (BD PoP). As the name implies, these packages don't have a mold cap or heat spreader surrounding the silicon die resulting in lower cost and smaller form factor. Further package thickness reduction is possible by thinning of silicon die without significantly affecting high temperature (HT) warpage or coplanarity. One of the main concerns with aforementioned bare die package (BDP) configurations is die crack failure during assembly, testing, shipping or surface mount operation (SMT). The propensity of die crack failures further increases as thinner die is employed to meet overall package height requirements. This work focusses on evaluating various inspection tools for detecting gross die cracks to fine line cracks up to ~ 0.7 μm wide. Some of the key considerations for inspection tools, at assembly and test operations will be presented.

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