Failure and Reliability of Electronic Materials and Devices

Reliability of WSN Hardware

“…Lifetime distributions should not be chosen blindly, but they should be chosen for one or more of the following three reasons: There is a physical argument that theoretically matches the observed failure mechanism to a particular distribution, a particular distribution has previously been used successfully for the same or a very similar failure mechanism, or a convenient distribution provides a good empirical fit to all the failure data. The most commonly used distributions include Exponential, Weibull, and Lognormal [16][17][18][19]. Even when a model is assumed, the mapping possibilities are still infinite since they depend on the parameters of the chosen model.…”

Monte Carlo simulation of electromigration phenomena in metallic lines

“…A fundamental ingredient in the description of the EM damage of the interconnects in electronic devices is represented by the granular structure of the materials employed, Al, Cu, Al alloys, etc. In fact, it has been observed [1][2][3] that the atomic transport through the grain boundaries (transport channels) far exceeds that through the grain bulks. Therefore, it is generally possible to neglect mass transport everywhere except within these channels and to describe the film as an interconnected grain boundary network [1].…”

“…Failure occurs in many cases by the degradation of metallic interconnects (thin films) which, because of electromigration (EM), lose their conducting properties. EM arises from the transport of matter at the atomic level driven by a high current density [1][2][3]. More precisely, the damage, consisting in the formation and growth of voids and hillocks in different regions of the film, is due to a non-steady atomic trasport associated with a nonvanishing divergence of the atomic flux.…”

“…In recent times, the study of breakdown phenomena in electrical devices has received a lot of attention, mainly for the increasing level of miniaturization which makes failure problems more and more crucial [1]. Failure occurs in many cases by the degradation of metallic interconnects (thin films) which, because of electromigration (EM), lose their conducting properties.…”

Reducing the Electrical Consumption in the Humidity Control Process for Electric Cells using an Intelligent Fuzzy Logic Controller

“…For adverse effects include the case of bad hygrothermic of buildings [3] which exacerbates the problem of indoor humidity and damage caused by the formation of mold and corrosion. Also moisture condensation poses problems of reliability of electronic components [4], the smooth operation of metal constructions [5], and particularly arcing of electrical installations [6] that cause the interruption of power homes and stopping industrial processes and causing huge financial losses.…”