Failure evaluation of flexible-rigid PCBs by thermo-mechanical simulation

Arruda, Luciano; Chen, Quayle; Quintero, Jairo

doi:10.1109/icept.2009.5270619

Cited by 11 publications

(2 citation statements)

References 9 publications

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“…Such tools also often incorporate thermal simulation in addition to mechanical bending to better model the impact of heat deformation on the flexible substrate and mounted parts. [775] For example, in Figure 59, an FE simulation of thermal and mechanical stress on a flexible substrate highlights a potential design issue, where a part mounted on flexible polyimide is potentially subject to bending beyond allowable specification.…”

Section: Figure 58 Simulated Bending Of a Flexible Pcb In Altium Designer [773]mentioning

confidence: 99%

Manufacturing Technology (MATES) II. Task Order 0006: Air Force Technology and Industrial Base Research Sub-Task 07: Future Advances in Electronic Materials and Processes-Flexible Hybrid Electronics

Medina¹,

Schneider²,

Temmesfeld³

et al. 2016

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Section: Figure 58 Simulated Bending Of a Flexible Pcb In Altium Designer [773]mentioning

confidence: 99%

Manufacturing Technology (MATES) II. Task Order 0006: Air Force Technology and Industrial Base Research Sub-Task 07: Future Advances in Electronic Materials and Processes-Flexible Hybrid Electronics

Medina¹,

Schneider²,

Temmesfeld³

et al. 2016

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show abstract

“…Bending stress on PCB can be damaging for substrate and resultantly the circuit reliability. Modeling of such stresses has been investigated for PCB and similar investigations on FHE substrates becomes complex because of the non-linearity in visco-elastic properties [30]. Therefore, the bending stress models available for PCBs cannot be applied implicitly for FHE.…”

Section: Introductionmentioning

confidence: 99%

Fabrication and non-destructive characterization of through-plastic-via (TPV) in flexible hybrid electronics

Sondhi

Avuthu

Richstein

et al. 2021

Flex. Print. Electron.

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Flexible hybrid electronics (FHE) have been gaining interest in recent years as this technology has the potential to become a low-cost, mechanically pliable sister technology for multilayer printed circuit boards (PCBs). One of the limitations of rigid PCB is low endurance to mechanical bending, this limitation poses a threat to the efficacy for wearable applications. During bending, a substrate experiences both compressive and tensile stress. These stresses are similar in magnitude but opposite in direction. This difference in directionality creates a non-linear stress gradient in a via which impacts the structural integrity, endurance and bending reliability of a circuit during its operation. Additionally, as flexible substrates can be bent to a higher bending radius, the magnitude of maximum extrinsic stresses observed on flexible substrates could be higher than the stress observed on rigid substrates. Hence, the reliability and mechanical compliance of through-hole-plastic-vias for reliable flexible circuits need to be understood. In this study, we have developed a process to create vias on flexible substrates using a rapid commercial laser (Nd-YaG laser) to study the effects on via resistance due to three different variables—bending stresses, via diameter and via length. A novel non-destructive approach (CT-scanner) was used to scan the via structures and determine the filling for all via diameters from 50 to 450 µm and via lengths of 7, 10 mils. Two different configurations of vias were used to measure and analyze the effect of mechanical cycling on via resistance and via filling. This demonstration of electrical and mechanical testing of vias and novel methodologies for via filling, and via electrical resistance can contribute to better design and fabrication guidelines of multi-layer FHE circuits.

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Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance

Leong

Abdullah

Khor

2012

Microelectronics Reliability

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Failure evaluation of flexible-rigid PCBs by thermo-mechanical simulation

Cited by 11 publications

References 9 publications

Manufacturing Technology (MATES) II. Task Order 0006: Air Force Technology and Industrial Base Research Sub-Task 07: Future Advances in Electronic Materials and Processes-Flexible Hybrid Electronics

Manufacturing Technology (MATES) II. Task Order 0006: Air Force Technology and Industrial Base Research Sub-Task 07: Future Advances in Electronic Materials and Processes-Flexible Hybrid Electronics

Fabrication and non-destructive characterization of through-plastic-via (TPV) in flexible hybrid electronics

Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance

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