Failure modes and FEM analysis of power electronic packaging

Hua, Yi; Lin, Mei-Hui; Basaran, Cemal

doi:10.1016/s0168-874x(01)00094-4

Cited by 142 publications

(57 citation statements)

References 16 publications

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“…Simulink blocks were used to generate thermal impedance equivalence defined in Equation (13) The mismatch among adjacent layers of the module is non uniform due to the coefficient of thermal expansions (CTE) differences of each material [35,36]. This generates thermally induced stress which causes deformation and eventual solder delamination and bond-wire lift off based on the stored elastic energy.…”

Section: -D Finite Element Modellingmentioning

confidence: 99%

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A Technique for Mitigating Thermal Stress and Extending Life Cycle of Power Electronic Converters Used for Wind Turbines

Batunlu

Albarbar

2015

Electronics

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Over the last two decades, various models have been developed to assess and improve the reliability of power electronic conversion systems (PECs) with a focus on those used for wind turbines. However, only few studies have dealt with mitigating the PECs thermo-mechanical effects on their reliability taking into account variations in wind characteristics. This work critically investigates this issue and attempts to offer a mitigating technique by, first, developing realistic full scale (FS) and partial scale (PS) induction generator models combined with two level back-to-back PECs. Subsequently, deriving a driving algorithm, which reduces PEC's operating temperature by controlling its switching patterns. The developed switching procedure ensures minimum temperature fluctuations by adapting the variable DC link and system's frequency of operation. It was found for both FS and PS topologies, that the generator side converters have higher mean junction temperatures where the grid side ones have more fluctuations on their thermal profile. The FS and PS cycling temperatures were reduced by 12 °C and 5 °C, respectively. Moreover, this led to a significant improvement in stress; approximately 27 MPa stress reduction for the FS induction generator PEC.

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Section: -D Finite Element Modellingmentioning

confidence: 99%

“…It is used in failure tests such as in [35] where the maximum von Mises stress should be less than the yield strength in such operations. Anand's model [37] was also used to describe the solder layers behaviour such as temperature sensitivity as described in [36].…”

Section: -D Finite Element Modellingmentioning

confidence: 99%

A Technique for Mitigating Thermal Stress and Extending Life Cycle of Power Electronic Converters Used for Wind Turbines

Batunlu

Albarbar

2015

Electronics

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“…As a result, electrothermal models have become an important tool for health monitoring and active control of power electronic converters [10]- [16]. However, these models all adopt fixed I thermal resistances throughout the device's lifespan so that the degradation of the materials in the thermal path during the device aging process is overlooked [17]- [22]. Without updating thermal models, it became increasingly difficult to predict the thermal performance of the device as the operating time goes on.…”

Section: Introductionmentioning

confidence: 99%

Real-Time Temperature Estimation for Power MOSFETs Considering Thermal Aging Effects

Chen¹,

Pickert

et al. 2014

IEEE Trans. Device Mater. Relib.

166

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Abstract-This paper presents a novel real-time power device temperature estimation method which monitors the power MOSFET's junction temperature shift arising from thermal aging effects and incorporates the updated electrothermal models of power modules into digital controllers. Currently, the real-time estimator is emerging as an important tool for active control of device junction temperature as well as on-line health monitoring for power electronic systems but its thermal model fails to address the device's ongoing degradation. Because of a mismatch of coefficients of thermal expansion between layers of power devices, repetitive thermal cycling will cause cracks, voids and even delamination within the device components, especially in the solder and thermal grease layers. Consequently, the thermal resistance of power devices will increase, making it possible to use thermal resistance (and junction temperature) as key indicators for condition monitoring and control purposes. In this paper, the predicted device temperature via threshold voltage measurements is compared with the real-time estimated ones and the difference is attributed to the aging of the device. The thermal models in digital controllers are frequently updated to correct the shift caused by thermal aging effects. Experimental results on three power MOSFETs confirm that the proposed methodologies are effective to incorporate the thermal aging effects in the power device temperature estimator with good accuracy. The developed adaptive technologies can be applied to other power devices such as IGBTs and SiC MOSFETs, and have significant economic implications.

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“…Consequently of high temperature, new constrains appear and become critical for power electronics assemblies. Several studies aim at identifying failure modes or critical interfaces [2,3]. In this field of research, non-destructive characterizations allow to study the mechanisms of degradation without disturbance due to the measurement itself (eg optical microscopy, acoustic microscopy, X-ray, infrared (IR) thermography).…”

Section: Introductionmentioning

confidence: 99%

Characterization of an integrated buck converter using infrared thermography

Viviès¹,

Haussener²,

Welemane³

et al. 2014

Proceedings of the 2014 International Conference on Quantitative InfraRed Thermography

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This study deals with new integrated systems for power electronics applications including wide-gap semiconductors. Integration of Silicon carbide (SiC) components provides for instance new perspectives with higher temperature operating points than conventional Silicon (Si) semiconductors. The present work intends to study an integrated buck converter composed of a Silicon IGBT (Insulated-Gate Bipolar Transistor) and a Silicon carbide diode. By means of infrared thermography, an analysis of the thermal disparities induced within such a hybrid assembly under various electrical loads is proposed, regarding especially the consequences of the electrical power transfer and the spatial distribution of the thermal field.

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Failure modes and FEM analysis of power electronic packaging

Cited by 142 publications

References 16 publications

A Technique for Mitigating Thermal Stress and Extending Life Cycle of Power Electronic Converters Used for Wind Turbines

A Technique for Mitigating Thermal Stress and Extending Life Cycle of Power Electronic Converters Used for Wind Turbines

Real-Time Temperature Estimation for Power MOSFETs Considering Thermal Aging Effects

Characterization of an integrated buck converter using infrared thermography

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