Fast and efficient approach to predict EMC immunity of complex equipment after a component change

Abstract

This paper describes a fast methodology for managing the obsolescence issues of components in industrial equipment (aeronautical and/or automotive). The objective is to predict Electromagnetic Compatibility (EMC) non-compliance risk or guarantee a non-regression of EMC performances, in conducted immunity, after a component change. This could be achieved through an equivalent test at the component level if the residual voltage at its pins could be estimated. Accordingly, this approach aims to decline conducted immunity requirements, from the connector at the input of an equipment to an obsolete component placed on one of its boards. Which must constitute a faster and cheaper solution than systematic EMC qualification test of the equipment each time a component is replaced.

A Technique to Assess Conducted Immunity of an Electronic Equipment after an Obsolete Integrated Circuit Change

“…the component used to replace the obsolete IC. The residual level of disturbance that reaches the IC pins can be determined by S-parameter measurements made at the equipment input connector, according to the methodology presented in [6]. The EMC risk assessment could be achieved by a conducted immunity test directly done at IC level, for example by the Direct Power Injection (DPI) method [7].…”

“…Nevertheless, if the IC can be removed and replaced by some passive loads, the transfer function can be determined by an indirect Sparameter measurement, made at the input connector side. The method, initially proposed in [15] and adapted to the case of IC change in [6], is used to extract the S-parameters matrix between the input and output ports of the equipment board, as a demonstrator, only from S-parameter measurements done at the input ports. Fig.…”