2021
DOI: 10.1109/tcsii.2020.3007858
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Fast Buffer Count Estimation in 3D IC Floorplanning

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Cited by 1 publication
(2 citation statements)
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“…To deal with the rising complexity of architecture, hierarchical and IPbased components are utilized, making floor planning throughout the VLSI design cycle is increasingly realistic. Researchers have recently discovered the benefits of VLSI floor planning (Vipin 2019;Lin et al 2021a;Mohapatra et al 2020), particularly comprising a large number of chips. The architecture that must be recognized has been put together in floor planning, and specific space should indeed be allocated with different satisfactory limits to bring things close together, thereby reducing the dead space and cost incurred Sivaranjani and Senthil Kumar 2015).…”
Section: Introductionmentioning
confidence: 99%
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“…To deal with the rising complexity of architecture, hierarchical and IPbased components are utilized, making floor planning throughout the VLSI design cycle is increasingly realistic. Researchers have recently discovered the benefits of VLSI floor planning (Vipin 2019;Lin et al 2021a;Mohapatra et al 2020), particularly comprising a large number of chips. The architecture that must be recognized has been put together in floor planning, and specific space should indeed be allocated with different satisfactory limits to bring things close together, thereby reducing the dead space and cost incurred Sivaranjani and Senthil Kumar 2015).…”
Section: Introductionmentioning
confidence: 99%
“…This heuristic approach (Srinivasan and Venkatesan 2021; Guler and Jha 2020) could be used for a global solution. The floor layouts are being shown using a rectangular dissection, and the borders have a rectangle form as well (Teng et al 2018;Chen et al 2018;Lin et al 2021b;Mohapatra et al 2020;Vehring et al 2020). These lines are given vertically or horizontally, and the modules are dumped in a rectangle form to improve the automation process.…”
Section: Introductionmentioning
confidence: 99%