Fast global interconnnect driven 3D floorplanning

Quiring, Artur; Olbrich, Markus; Barke, Erich

doi:10.1109/vlsi-soc.2015.7314436

Cited by 5 publications

(1 citation statement)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…For 3D chip stacks, the module arrangement is interdependent across the whole stack, rendering 3D floorplanning much more complex than 2D floorplanning. 2 Existing floorplanning methodologies already address key challenges such as thermal management [27,[34][35][36], co-arrangement of modules and TSVs [59] or planning of system-level buses [27,36,60]. Still, 3D floorplanning is a highly technology-dependent and iterative process-fast, accurate and configurable design evaluation is currently targeted but still to be enhanced [61,62].…”

Section: Partitioning and Floorplanningmentioning

confidence: 99%

Physical Design Automation for 3D Chip Stacks

Knechtel¹,

Lienig²

2016

Proceedings of the 2016 on International Symposium on Physical Design

View full text Add to dashboard Cite

The concept of 3D chip stacks has been advocated by both industry and academia for many years, and hailed as one of the most promising approaches to meet ever-increasing demands for performance, functionality and power consumption going forward. However, a multitude of challenges has thus far obstructed large-scale transition from "classical" 2D chips to stacked 3D chips. We survey major design challenges for 3D chip stacks with particular focus on their implications for physical design. We also derive requirements for advances in design automation, such as the need for a unified workflow. Finally, we outline current promising solutions as well as areas needing further research and development. bly design kit; design standards 2. 3D-CHIP STACKING OPTIONS AND HIGH-LEVEL DESIGN CHALLENGES 3D-chip stacking falls into four categories (Fig. 2): (i) package stacking, (ii) interposer stacks, (iii) through-silicon via (TSV)based 3D ICs, and (iv) monolithic 3D ICs. Each option has its This work is licensed under a Creative Commons Attribution-NonCommercial-ShareAlike International 4.0 License.

show abstract