We report a comprehensive study of the maximization of the spin Hall ratio (θSH) in Pt thin films by the insertion of submonolayer layers of Ti to decrease carrier lifetime while minimizing the concurrent reduction in the spin Hall conductivity. We establish that the intrinsic spin Hall conductivity of Pt, while robust against the strain and the moderate interruption of crystal order caused by these insertions, begins to decrease rapidly at high resistivity level because of the shortening carrier lifetime. The unavoidable trade-off between the intrinsic spin Hall conductivity and carrier lifetime sets a practical upper bound of θSH ≥0.8 for heterogeneous materials where the crystalline Pt component is the source of the spin Hall effect and the resistivity is increased by shortening carrier lifetime. This work also establishes a very promising spin-Hall metal of [Pt 0.75 nm/Ti 0.2 nm]7/Pt 0.75 nm for energy-efficient, high-endurance spin-orbit torque technologies (e.g., memories, oscillators, and logic) due to its combination of a giant θSH ≈ 0.8, or equivalently a dampinglike spin torque efficiency per unit current density DL ≈ 0.35, with a relatively low resistivity (90 μΩ cm) and high suitability for practical technology integration.Spin Hall metals with strong dampinglike spin-orbit torque (SOT) efficiency per unit current density ( DL ) and relatively low resistivity (ρxx) are the key for developing practical spin-orbit torque technologies (e.g., memories, oscillators, and logic)[1-10] that require energy efficiency, high endurance, and low impedance [11,12]. For example, for a SOT-MRAM device with a spin Hall channel (with thickness dHM and resistivity ρxx)/FM free layer (with thickness t and resistivity ρFM), the write current is approximately Iwrite∝ (1+s) / DL , and the corresponding write energy is Pwrite ∝ [(1+s) / DL ] 2 ρxx, where s ≈ tρxx/dHMρFM is the ratio of the current shunting in the FM layer over the current flow in the spin Hall channel (see Fig. 1(a)). Meanwhile, a high ρxx of a spin Hall material (e.g., ρxx ≥ 200 μΩ cm in Ta [2], W [8,13,14], and topological insulators [15,16]) is problematic for applications that require a high endurance [17] and low device impedance (∝ρxx) [18]. For example, use of a large-ρxx spin Hall material (e.g., ρxx =200 -300 μΩ cm for W, see Fig. 1(b)) will limit the endurance of SOT devices via Joule-heating-induced bursting and migration of the write line [17] as well as result in a high write impedance that is difficult for superconducting circuits in a cryogenic computing system to accommodate [18]. It is therefore of great technological and fundamental importance to establish how, why, and to what limit the spin Hall ratio (θSH) and DL of a spin Hall metal with a giant spin Hall conductivity (σSH) and a relatively low ρxx can be enhanced in practice.Among the various spin Hall metals, Pt is particularly attractive for spin-torque technologies due to its low ρxx, the highest intrinsic σSH known for the simple technologically viable metals (> 1.6×10 6 (ℏ/2e) Ω ...