2019
DOI: 10.1016/j.addma.2019.100898
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Fast solution strategy for transient heat conduction for arbitrary scan paths in additive manufacturing

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Cited by 29 publications
(13 citation statements)
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“…To understand the influence of process conditions on microstructure development, a simplified semi-analytical heat conduction model was utilized to approximate the trends in solidification conditions. Similar approaches have been successfully implemented in other studies to rationalize the influence of process conditions on microstructure and defects 40 44 . The model used here relies on the mathematical solution for a moving volumetric Gaussian heat source originally derived by Nguyen et al 45 , and uses an adaptive Gaussian quadrature scheme to efficiently and accurately compute the melt pool behavior over long length and time scales 46 .…”
Section: Methodsmentioning
confidence: 95%
“…To understand the influence of process conditions on microstructure development, a simplified semi-analytical heat conduction model was utilized to approximate the trends in solidification conditions. Similar approaches have been successfully implemented in other studies to rationalize the influence of process conditions on microstructure and defects 40 44 . The model used here relies on the mathematical solution for a moving volumetric Gaussian heat source originally derived by Nguyen et al 45 , and uses an adaptive Gaussian quadrature scheme to efficiently and accurately compute the melt pool behavior over long length and time scales 46 .…”
Section: Methodsmentioning
confidence: 95%
“…One-dimensional DICTRA solidification models are implemented using the TC-Python application programming interface to enable batch calculations as a function of both processing conditions and composition. The semi-analytic laser powder bed fusion (LPBF) process model developed by Wolfer et al [21], which uses a Green's function approach, is coupled with DICTRA simulations and the Kou SCS model [13,14] to create a CALPHAD-based ICME framework for modeling non-equilibrium solidification in additively manufactured materials. Temperature histories under different processing conditions are used as an input for DICTRA solidification calculations to investigate the relationship between the additive manufacturing process and non-equilibrium solidification.…”
Section: Methodsmentioning
confidence: 99%
“…To understand the influence of process conditions on microstructure development, a simplified semianalytical heat conduction model was utilized to approximate the trends in solidification conditions. Similar approaches have been successfully implemented in other studies to rationalize the influence of process conditions on microstructure and defects [37][38][39][40][41] . The model used here relies on the mathematical solution for a moving volumetric Gaussian heat source originally derived by Nguyen et al 42 , and uses an adaptive Gaussian quadrature scheme to efficiently and accurately compute the melt pool behavior over long length and time scales 43 .…”
Section: Solidification Condition Calculationsmentioning
confidence: 96%