Fat damascene wires for high bandwidth routing in silicon interposer

Detalle, Mikael; Kim, J.; Nolmans, P.; Sun, Xiankai; Ryckaert, Julien; Manna, A. La; Beyer, Gerald; Beyne, Eric

doi:10.7567/ssdm.2012.h-6-5

Cited by 4 publications

(2 citation statements)

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“…Associating the processing of the MIM capacitors with the processing of the fat interconnect lines and dielectric layers can compensate a large portion of the induced stresses and restrain the amount of die warpage [11].…”

Section: Cost Of Metal Planes and Mim-cap Processingmentioning

confidence: 99%

“…Implementation of these power supply planes is considered using single Cu damascene process with metal thickness of 1μm [11]. Furthermore, the co-existence of both the power and ground planes on the same interposer substrate enables the fabrication of a metal-insulator-metal (MIM) capacitor that can function as a decoupling capacitor for the power distribution network.…”

Section: Cost Of Metal Planes and Mim-cap Processingmentioning

confidence: 99%

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Si interposer build-up options and impact on 3D system cost

Velenis

Detalle

Marinissen

et al. 2013

2013 IEEE International 3D Systems Integration Conference (3DIC)

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The requirements for embedded system functionalities promote stacked integration solutions where interposers are used as large carriers to provide dense interconnections among functional dies. Using the cost model developed at imec, the processing cost of different interposer features is analyzed. Build-up options of various interposer configurations are compared and the additional cost of the interposer component is highlighted. In addition the impact of interposer testing on the system cost is investigated for different interposer substrate areas.

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Section: Cost Of Metal Planes and Mim-cap Processingmentioning

confidence: 99%

Section: Cost Of Metal Planes and Mim-cap Processingmentioning

confidence: 99%