2014
DOI: 10.1007/s10854-014-2392-2
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Fatigue life study of ITO/PET specimens in cyclic bending tests

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Cited by 13 publications
(9 citation statements)
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“…The AFM results indicate that cracks are not initiated at the ITO outer surface. A similar observation has been reported by Li and Lin [16] that cracks are preferentially initiated at the interface between ITO layer and substrate during bending.…”
Section: Failure Analysissupporting
confidence: 88%
See 1 more Smart Citation
“…The AFM results indicate that cracks are not initiated at the ITO outer surface. A similar observation has been reported by Li and Lin [16] that cracks are preferentially initiated at the interface between ITO layer and substrate during bending.…”
Section: Failure Analysissupporting
confidence: 88%
“…For prolonged use of such devices, long-term failure mechanisms related to electrical characteristics of conductive layers of flexible organic optoelectronics should be considered. Although investigations on electrical conductivity of ITO thin films under bending have been conducted in previous studies, the change of electrical conductivity is mostly assessed after cyclic bending [12,[15][16][17]20,22,31,42,[48][49][50][51] or static bending [40]. However, it is necessary to study the concurrent change of electrical conductivity of ITO thin film under long-term mechanical bending, and its correlation with the mechanical failure mechanism.…”
Section: Introductionmentioning
confidence: 99%
“…A bend radius of 0.75cm-1cm has been shown to have no influence on the resistance of the PET-ITO [45]. However, not only the bend radius is increasing the resistance of the PET-ITO but also repetitive bending as it leads to microcracks [46,47]. Given results presented by Li and Lin it is expected that after ca.…”
Section: Prototyping Transprint Displaysmentioning
confidence: 99%
“…Given results presented by Li and Lin it is expected that after ca. 300 bends with 17.3N strain the PET-ITO would reach a level were a significant increase in switching time would be visible and after 2000 bends being most likely be unusable due to the number of microcracks [47].…”
Section: Prototyping Transprint Displaysmentioning
confidence: 99%
“…The effects of bending on the reliability of flexible electronic devices has already been reported in the literature. Li and Jin 13 reported the appearance of microcracks after cyclic bending tests of indium tin oxide films deposited on a polyethylene terephthalate substrate; the electrical resistance increased nonlinearly with a sufficiently large number of cycles. Billah et al 14 reported changes in device performance of flexible amorphous indium gallium zinc oxide thin-film transistors under repeated tensile or compressive bending stress; these changes were found to be related to the generation of oxygen vacancies.…”
Section: Introductionmentioning
confidence: 99%