Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint

Jian, Minghong; Su, Sinan; Hamasha, Sa’d; Hamasha, Mohammad M.; Alkhazali, Atif

doi:10.1115/1.4047341

Cited by 13 publications

(4 citation statements)

References 28 publications

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“…( 4) is a power equation that was employed to illustrate the relationship www.nature.com/scientificreports/ between the inelastic work and the fatigue life, or the characteristic life. Where Z ( the fatigue exponent) and R (the ductility coefficient) are the equation constants, and W is the average inelastic work per cycle 26,27 . In addition, the plastic stain was employed to model the fatigue life using a power equation provided in Eq.…”

Section: Methodsmentioning

confidence: 99%

Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model

Hani

Athamneh

Abueed

et al. 2023

Sci Rep

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Reliability of the microelectronic interconnection materials for electronic packages has a significant impact on the fatigue properties of the electronic assemblies. This is due to the correlation between solder joints reliability and the most frequent failure modes seen in electronic devices. Due to their superior mechanical and fatigue properties, SAC alloys have supplanted Pb-solder alloys as one of the most commonly used solder materials used as interconnection joints on electronic packages. The main aim of this study is to develop a prediction model of the fatigue life of the solder joints as a function of the experimental conditions. Using a customized experimental setup, an accelerated fatigue shear test is applied to examine the fatigue life of the individual SAC305 solder joints at actual setting conditions. OSP surface finish and solder mask defined are used in the studied test vehicle. The fatigue test includes three levels of stress amplitude and four levels of testing temperature. A two-parameter Weibull distribution is used for the reliability analysis for the fatigue life of the solder joints. A stress–strain curve is plotted for each cycle to construct the hysteresis loop at each cyclic load and testing temperature. The acquired hysteresis loop is used to estimate the inelastic work per cycle and plastic strain. The Morrow energy and Coffin Manson models are employed to describe the effects of the fatigue properties on the fatigue life of the solder joints. The Arrhenius model is implemented to illustrate the evolutions in the stress life, Morrow, and Coffin Manson equations at various testing temperatures. The fatigue life of SAC305 solder joints is then predicted using a general reliability model as a function of the stress amplitude and testing temperature.

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Section: Methodsmentioning

confidence: 99%

Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model

Hani

Athamneh

Abueed

et al. 2023

Sci Rep

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“…It can be observed that the typical lifetime decreases as the aging time increases. Furthermore, SAC305 declined with age in various stress amplitude tests because SAC305 showed less aging resistance at a single stress amplitude [ 28 ]. Similar degradation of SAC-Q was detected, as indicated in Figure 7 b.…”

Section: Resultsmentioning

confidence: 99%

“…In single stress cycles, SAC-Q exhibited the best aging resistance. However, the characteristic life of SAC-R after 10 h and 1000 h of aging did not reveal substantial degradation, decreasing by only 2% and 7%, respectively [ 28 ].…”

Section: Resultsmentioning

confidence: 99%

Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions

et al. 2023

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Solder joints are subjected to varied stress cycle circumstances in the electronic packaging service life but are also influenced by aging. There has been limited investigation into the influence of aging and varying cycles on SnAgCu-Bi (SAC-Bi) solder joint fatigue. Cyclic fatigue tests were performed on solder joints of several alloys, including SnAgCu (SAC305), SnAgCu-Bi (SAC-Q), and SnCu-Bi (SAC-R). Individual solder joints were cycled under varying stress levels, alternating between mild and harsh stress levels. At least seven samples were prepared for each alloy by alternating between 25 mild stress (MS) cycles and three harsh stress (HS) cycles until the solder joint broke off. The impact of aging on Bi-doped solder joints fatigue under varied amplitude stress was examined and predicted for 10 and 1000 h under 125 °C. Because of the “Step-up” phenomenon of inelastic work, a new fatigue model was developed based on the common damage accumulation (CDA) model. The experimental results revealed that aging reduced the fatigue life of the tested solder alloys, particularly that of SAC305. According to the CDA model, all solder alloys failed earlier than expected after aging. The proposed model uses the amplification factor to assess inelastic work amplification after switching between the MS and HS cycles under varying stress amplitude conditions. The amplification factor for the SAC-Bi solder alloys increased linearly with fracture initiation and substantially followed crack propagation until the final failure. Compared with existing damage accumulation models, the proposed fatigue model provides a more accurate estimation of damage accumulation. For each case, the cut-off positions were examined. The SAC-Q amplification factor increased linearly to 83% of its overall life, which was much higher than that of SAC305 and SAC-R. This study identified three distinct failure modes: ductile, brittle, and near intermetallic compound (IMC) failure. It was also observed that SAC-Q with an organic solderability preservatives (OSP) surface finish was more susceptible to brittle failure owing to the excessive brittleness of the alloy material.

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“…The toxicity of lead to the human body, the research of lead-free solder has become a basic and critical task in the electronics industry. The melting properties, weldability and mechanical properties of the solder alloys should be considered when lead-free solders were investigated (Alkhazali et al , 2021). The Sn-Ag-Cu solder alloy is considered as the most promising material to replace eutectic Sn-Pb solder owing to its unsurpassed comprehensive performance (Chen et al , 2015; Sun et al , 2016; Hu et al , 2021; Shao et al , 2018).…”

Section: Introductionmentioning

confidence: 99%

Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder

Liu,

Wang,

Zhou

et al. 2024

SSMT

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Purpose The purpose of this study is to investigate the effects of Ce and Sb doping on the microstructure and thermal mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder. The effects of 0.5%Sb and 0.07%Ce doping on microstructure, thermal properties and mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder were investigated. Design/methodology/approach According to the mass ratio, the solder alloys were prepared from tin ingot, antimony ingot, silver ingot and copper ingot with purity of 99.99% at 400°C. X-ray diffractometer was adopted for phase analysis of the alloys. Optical microscopy, scanning electron microscopy and energy dispersive spectrometer were used to study the effect of the Sb and Ce doping on the microstructure of the solder. Then, the thermal characteristics of alloys were characterized by a differential scanning calorimeter (DSC). Finally, the ultimate tensile strength (UTS), elongation (EL.%) and yield strength (YS) of solder alloys were measured by tensile testing machine. Findings With the addition of Sb and Ce, the ß-Sn and intermetallic compounds of solders were refined and distributed more evenly. With the addition of Sb, the UTS, EL.% and YS of Sn-1.0Ag-0.5Cu increased by 15.3%, 46.8% and 16.5%, respectively. The EL.% of Sn-1.0Ag-0.5Cu increased by 56.5% due to Ce doping. When both Sb and Ce elements are added, the EL.% of Sn-1.0Ag-0.5Cu increased by 93.3%. Originality/value The addition of 0.5% Sb and 0.07% Ce can obtain better comprehensive performance, which provides a helpful reference for the development of Sn-Ag-Cu lead-free solder.

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Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint

Cited by 13 publications

References 28 publications

Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model

Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model

Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions

Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder

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