Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model

Abstract

Reliability of the microelectronic interconnection materials for electronic packages has a significant impact on the fatigue properties of the electronic assemblies. This is due to the correlation between solder joints reliability and the most frequent failure modes seen in electronic devices. Due to their superior mechanical and fatigue properties, SAC alloys have supplanted Pb-solder alloys as one of the most commonly used solder materials used as interconnection joints on electronic packages. The main aim of this study is to develop a prediction model of the fatigue life of the solder joints as a function of the experimental conditions. Using a customized experimental setup, an accelerated fatigue shear test is applied to examine the fatigue life of the individual SAC305 solder joints at actual setting conditions. OSP surface finish and solder mask defined are used in the studied test vehicle. The fatigue test includes three levels of stress amplitude and four levels of testing temperature. A two-parameter Weibull distribution is used for the reliability analysis for the fatigue life of the solder joints. A stress–strain curve is plotted for each cycle to construct the hysteresis loop at each cyclic load and testing temperature. The acquired hysteresis loop is used to estimate the inelastic work per cycle and plastic strain. The Morrow energy and Coffin Manson models are employed to describe the effects of the fatigue properties on the fatigue life of the solder joints. The Arrhenius model is implemented to illustrate the evolutions in the stress life, Morrow, and Coffin Manson equations at various testing temperatures. The fatigue life of SAC305 solder joints is then predicted using a general reliability model as a function of the stress amplitude and testing temperature.

A Reliability Analysis of a MEMS Flow Sensor with an Accelerated Degradation Test

“…ε was obtained from the Coffin-Manson modeling. Specifically, the Arrhenius lifetime model was employed in the degradation model, which has been widely used in the reliability literature [31][32][33][34].…”

Low-cycle fatigue life assessment of SAC solder alloy through a FEM-data driven machine learning approach

“…Over the past decades, the electronics industry has witnessed a rapid evolution toward smaller and more complex devices, leading to increased demands on the reliability and durability of solder joints (Bani Hani et al, 2023a;Arriola et al, 2022;Samavatian et al, 2020aSamavatian et al, , 2022aXiong et al, 2023). One of the significant challenges faced by electronic instruments is lowcycle fatigue (LCF) in solder joints, which has emerged as a critical failure mechanism (Wei et al, 2023b).…”