FBGA solder ball defect effect on DDR4 data signal rise time and ISI measured by loading the data line with a capacitor

Waqar, Muhammad; Baeg, Sanghyeon; Bak, Geunyong; Kwon, Junhyeong; Lee, Kiseok; Jeon, Sang Hoon

doi:10.1016/j.microrel.2020.113916

Cited by 4 publications

(5 citation statements)

References 7 publications

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“…The crack in solder ball can be mimicked by loading the data line with a capacitive element [12]. The value of capacitive element corresponds to the dimensions of the crack.…”

Section: Measurement Setupmentioning

confidence: 99%

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DDR4 BER Degradation Due to Crack in FBGA Package Solder Ball

et al. 2021

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This paper measures bit error rate degradation in DDR4 due to crack in fine pitch ball grid array (FBGA) package solder ball. Thermal coefficient mismatch between the package and printed circuit board material causes cracks to occur in solder balls. These cracks change the electrical model of the solder ball and introduce parallel capacitance in the electrical model. The capacitance causes higher frequency attenuation and closes the data eye. As the data rate of the DDR4 increases there are more data eye closures. The data eye closure causes bit error rate (BER) degradation as the timing margin and voltage margin decreases. This degradation reduces the reliability of the system and causes more intermittent errors. DDR4 data line is loaded with a parallel capacitive element to mimic a crack in solder ball. The measured data eye shows a decrease in eye width. Bathtub plots are created for comparison of cracked solder ball and intact solder ball. The bathtub plots show the BER degradation due to crack in solder ball.

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“…The crack in solder ball can be mimicked by loading the data line with a capacitive element [12]. The value of capacitive element corresponds to the dimensions of the crack.…”

Section: Measurement Setupmentioning

confidence: 99%

“…To see the effect of crack in solder ball on the signal integrity of the DDR4 data channel, the data channel is loaded with a capacitive element [12]. The value of the capacitive element corresponds to the dimensions of the crack.…”

Section: Introductionmentioning

confidence: 99%

DDR4 BER Degradation Due to Crack in FBGA Package Solder Ball

et al. 2021

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“…With the development of electronic products towards high performance, high reliability, and miniaturization, they have also put forward more requirements for microelectronic packaging, such as having more I/O numbers, better thermal performance, and higher reliability. Due to the merit of good structure, excellent electrical performance, and excellent heat dissipation, the BGA (ball grid array) package is widely used [1] . With the widespread application of BGA in electronic products, its reliability problem is becoming increasingly significant and has become an important research direction.…”

Section: Introductionmentioning

confidence: 99%

Reliability analysis and optimization of BGA solder based on finite element simulation

Lei,

Yang,

Liang

2024

J. Phys.: Conf. Ser.

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For the reason of reliability improvement of BGA solder, ANSYS is used to establish a BGA solder model that contains information such as size, material, grid, etc. The thermal stress of solder is selected as the optimization objective by the optimization parameters of solder height, solder radial direction, and spacing of solder. Response surface methodology is used to design 17 sets of different level parameters for simulation calculations, and a regression equation between solder joint stress and optimization parameters is established to obtain the parameter combination with the minimum stress of solder. The analysis results show that the corner solder far from the chip are critical solder joint for failure. The optimized solder joint parameters are as follows. The solder height is 0.5 mm, the solder radial is 0.6 mm, and the solder spacing is 1 mm. The optimized solder joint stress value is 30.818 MPa, which reduces the stress by 27.71% compared to before optimization, which achieved the reliability improvement of BGA solder.

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“…With the development of electronic information technology, electronic components are required to be miniaturized, highdensity, low-cost, and highly reliable, aiming to achieve higher hardware integration within limited space. BGA packaging technology is a high-density, mechanically robust, and highly compatible packaging technology [1] . Currently, BGA packaging technology has become the mainstream form of System-in-Package (SIP) devices and an excellent packaging solution for enhancing the hardware integration of electronic products [2] .…”

Section: Introductionmentioning

confidence: 99%

Simulation study on the influence of electronic component heat generation on BGA solder joint thermal fatigue

Yang,

Cai,

Lin

et al. 2023

International Conference on Electronic Materials and Information Engineering (EMIE 2023)

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FBGA solder ball defect effect on DDR4 data signal rise time and ISI measured by loading the data line with a capacitor

Cited by 4 publications

References 7 publications

DDR4 BER Degradation Due to Crack in FBGA Package Solder Ball

DDR4 BER Degradation Due to Crack in FBGA Package Solder Ball

Reliability analysis and optimization of BGA solder based on finite element simulation

Simulation study on the influence of electronic component heat generation on BGA solder joint thermal fatigue

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