Fe-substituted silica via lattice dissolution–reprecipitation replacement for tungsten chemical mechanical planarization

Sun, Soho; Lee, Kangchun; Lee, Ganggyu; Kim, Yehwan; Kim, Seong–Min; Hwang, Junha; Kong, Hyungoo; Chung, Kyung Yoon; Ali, Ghulam; Song, Taeseup; Paik, Ungyu

doi:10.1016/j.jiec.2022.04.001

Cited by 6 publications

(3 citation statements)

References 40 publications

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“…Doping with Sm 3+ , Nb 3+ , Al 3+ , Fe 3+ , and Co 3+ ions, which meet these criteria has been reported (Lei et al, 2019;Liu and Lei, 2017;Ma et al, 2015;Sun et al, 2022). Silica doped with these ions maintains smooth surface and has higher zeta potential than un-doped silica, resulting in higher dispersion stability.…”

Section: Metal Doped Silica Nanoparticlesmentioning

confidence: 98%

“…Some particles exhibit improved reactivity by embedding particles with a chemically catalytic effect on the silica surface (Fig. 7(c)) (Sun et al, 2022). Other particles have a controlled zeta potential or improved chemical reactivity through the doping of other metals (Fig.…”

Section: Modification Of Silica Nanoparticlesmentioning

confidence: 99%

“…At the same time, metal hydroxides with similar tetrahedral structure can replace vacant Si(OH) 4 sites. According to Sun et al (2022), the synthesis of pH is crucial in this reaction and proceeds under conditions in which Si(OH) 4 can dissolve. Fig.…”

Section: Metal Doped Silica Nanoparticlesmentioning

confidence: 99%

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Engineering SiO<sub>2</sub> Nanoparticles: A Perspective on Chemical Mechanical Planarization Slurry for Advanced Semiconductor Processing

Lee,

Sun

et al. 2023

KONA

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Chemical mechanical polishing (CMP) is a process that uses mechanical abrasive particles and chemical interaction in slurry to remove materials from the surface of films. With advancements in semiconductor device technology applying various materials and structures, SiO 2 (silica) nanoparticles are the most chosen abrasives in CMP slurries. Therefore, understanding and developing silica nanoparticles are crucial for achieving CMP performance, such as removal rates, selectivity, decreasing defects, and high uniformity and flatness. However, despite the abundance of reviews on silica nanoparticles, there is a notable gap in the literature addressing their role as abrasives in CMP slurries. This review offers an in-depth exploration of silica nanoparticle synthesis and modification methods detailing their impact on nanoparticles characteristics and CMP performance. Further, we also address the unique properties of silica nanoparticles, such as hardness, size distribution, and surface properties, and the significant contribution of silica nanoparticles to CMP results. This review is expected to interest researchers and practitioners in semiconductor manufacturing and materials science.

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Section: Metal Doped Silica Nanoparticlesmentioning

confidence: 98%

Section: Modification Of Silica Nanoparticlesmentioning

confidence: 99%