Feasibility Study of Process Integration for High Aspect Ratio Hard-Mask Scheme Technologies of Low-k/Cu Interconnect Fabrication

Abstract

Integrated circuit (IC) manufacturing process reliability is gaining increasing importance in fabrication technology with decreasing device size and the impact of interconnect failure mechanisms. As device geometries are reduced, understanding and minimizing the sources of process-induced defects is critical to achieving process reliability and maintaining high device yields. It has been known that pattern missing and defects could be prevented by optimizing the process module tuning. The abnormal pattern collapse observed in this process and numerous defects could be prevented by optimizing the fabrication process module tuning. To successfully integrate submicron dual damascene process with good electrical and reliability performance after process improvement of lithography patterning, etching feasibility studies on semiconductor wafer fabrication processes were included. To suppress problems in the hard mask approach of photolithography and optimal etching patterning processes, the balance of the processes integration are quantitatively controlled with this optimum wafer integrated fabrication technologies.

SU-8-Based Structural Material for Microelectronic Processing Applications

“…Epoxy-based SU-8 is a high-contrast, near-UV negative photo-resist applied in the microelectromechanical systems (MEMS) field due to its good mechanical and chemical stability, ease of processing, good optical properties, and ability to form high-aspect-ratio (HAR) structures [1,2]. In earlier work, SU-8 was used as a thick-film photo-resist to realize HAR patterns in the UV LIGA process [3], but several later approaches have used SU-8 as a popular material in other areas of microfabrication, ranging from optics [4,5] to microgrippers [6,7], and microfluidic devices [8,9] due to its diversified functionality as a self-sacrificial layer or sacrificial material for etching [10,11], and as a structural material integral to the fabricated device [6,12].…”

Manufacturing process development of a precision rapid tooling with high‐aspect‐ratio micro‐sized features

“…Microelements with high‐aspect‐ratio can be used for various applications, such as microflidics, chemical sensors and medical imaging devices . These methods include lithography, electroplating, and molding, X‐ray lithography, deep‐reactive ion etching, laser ablation, and UV lithography .…”